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Global Advanced IC Substrates Market


Global Advanced IC Substrates Market 2022-2031 by Packaging Type (FC BGA, FC CSP, Others), Material Type (Rigid, Flex, Ceramic), Manufacturing Method (SP, AP, MSAP), Bonding Technology (Wire Bonding, FC Bonding, TAB), Application (Mobile and Consumer Electronics, Automotive and Transportation, IT and Telecom, Others), and Region: Trend Forecast and Growth Opportunity

Report code: SDMRCO1690513 | Industry: Computers, Electrics & Communications | Published On: 2023-04-30


Global advanced IC substrates market will reach $16,953.8 million by 2031, growing by 7.3% annually over 2022-2031, driven by the rising adoption of advanced substrates in manufacturing of electronics, the increasing prevalence and functionality of consumer electronic products such as smart devices and smart wearables, and the increasing penetration of advanced technologies such as 5G and IoT connected devices.
Highlighted with 110 tables and 82 figures, this 187-page report “Global Advanced IC Substrates Market 2022-2031 by Packaging Type (FC BGA, FC CSP, Others), Material Type (Rigid, Flex, Ceramic), Manufacturing Method (SP, AP, MSAP), Bonding Technology (Wire Bonding, FC Bonding, TAB), Application (Mobile and Consumer Electronics, Automotive and Transportation, IT and Telecom, Others), and Region: Trend Forecast and Growth Opportunity” is based on a comprehensive research of the entire global advanced IC substrates market and all its sub-segments through extensively detailed classifications. Profound analysis and assessment are generated from premium primary and secondary information sources with inputs derived from industry professionals across the value chain. The report is based on studies on 2021-2022 and provides forecast from 2023 till 2031 with 2022 as the base year. (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)

In-depth qualitative analyses include identification and investigation of the following aspects:
• Market Structure
• Growth Drivers
• Restraints and Challenges
• Emerging Product Trends & Market Opportunities
• Porter’s Fiver Forces
The trend and outlook of global market is forecast in optimistic, balanced, and conservative view by taking into account of COVID-19 and Russia-Ukraine conflict. The balanced (most likely) projection is used to quantify global advanced IC substrates market in every aspect of the classification from perspectives of Packaging Type, Material Type, Manufacturing Method, Bonding Technology, Application, and Region.

Based on Packaging Type, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section.
• FC BGA
• FC CSP
• Other Packaging Types

Based on Material Type, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section.
• Rigid Integrated Circuit Substrate
• Flex Integrated Circuit Substrate
• Ceramic Integrated Circuit Substrate

By Manufacturing Method, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section.
• Subtraction Process (SP)
• Addition Process (AP)
• Modified Semi-additive Process (MSAP)

By Bonding Technology, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section.
• Wire Bonding
• FC Bonding
• Tape Automated Bonding (TAB)

By Application, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section.
• Mobile and Consumer Electronics
• Automotive and Transportation
• IT and Telecom
• Other Applications

Geographically, the following regions together with the listed national/local markets are fully investigated:
• North America (U.S., Canada, and Mexico)
• Europe (Germany, UK, France, Spain, Italy, Netherlands, Rest of Europe; Rest of Europe is further segmented into Russia, Switzerland, Poland, Sweden, Belgium, Austria, Ireland, Norway, Denmark, and Finland)
• APAC (Japan, China, South Korea, Australia, Taiwan, and Rest of APAC; Rest of APAC is further segmented into Malaysia, Singapore, Indonesia, Thailand, New Zealand, Vietnam, India, and Philippines)
• South America (Brazil, Chile, Argentina, Rest of South America)
• MEA (UAE, Saudi Arabia, South Africa and Rest of MEA)
For each aforementioned region and country, detailed analysis and data for annual revenue ($ mn) are available for 2022-2031. The breakdown of all regional markets by country and split of each national market by Packaging Type, Material Type and Application over the forecast years are also included.

The report also covers the current competitive scenario and the predicted trend; and profiles key vendors including market leaders and important emerging players.
Selected Key Players:
ASE Group
AT&S Austria Technologie & Systemtechnik AG
Fujitsu Ltd.
IBIDEN Co., Ltd.
Kinsus Interconnect Technology Corp.
Korea Circuit Co., Ltd.
KYOCERA Corporation
LG Innotek Co., Ltd.
Nan Ya PCB Co., Ltd. (Nan Ya Plastics Corporation)
Shenzhen Fastprint Circuit Tech
Shinko Electric Industries Co., Ltd.
Siliconware Precision Industries Co., Ltd.
STATS ChipPAC Pte. Ltd. (JCET GROUP CO. LTD)
TTM Technologies Inc.
Unimicron Corporation
Zhen Ding Technology Holding Ltd.
Zhuhai ACCESS Semiconductor
(Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)

1  Introduction 10
1.1  Industry  Definition  and  Research  Scope 10
1.1.1  Industry  Definition 10
1.1.2  Research  Scope 11
1.2  Research  Methodology 14
1.2.1  Overview  of  Market  Research  Methodology 14
1.2.2  Market  Assumption 15
1.2.3  Secondary  Data 15
1.2.4  Primary  Data 15
1.2.5  Data  Filtration  and  Model  Design 16
1.2.6  Market  Size/Share  Estimation 17
1.2.7  Research  Limitations 18
1.3  Executive  Summary 19
2  Market  Overview  and  Dynamics 22
2.1  Market  Size  and  Forecast 22
2.1.1  Impact  of  COVID-19  on  World  Economy 24
2.1.2  Impact  of  COVID-19  on  the  Market 27
2.1.3  Impact  of  Russia-Ukraine  Conflict:  War  Slows  Economic  Recovery 29
2.2  Major  Growth  Drivers 33
2.3  Market  Restraints  and  Challenges 38
2.4  Emerging  Opportunities  and  Market  Trends 41
2.5  Porter’s  Fiver  Forces  Analysis 45
3  Segmentation  of  Global  Market  by  Packaging  Type 49
3.1  Market  Overview  by  Packaging  Type 49
3.2  FC  BGA 51
3.3  FC  CSP 52
3.4  Other  Packaging  Types 53
4  Segmentation  of  Global  Market  by  Material  Type 54
4.1  Market  Overview  by  Material  Type 54
4.2  Rigid  Integrated  Circuit  Substrate 56
4.3  Flex  Integrated  Circuit  Substrate 57
4.4  Ceramic  Integrated  Circuit  Substrate 58
5  Segmentation  of  Global  Market  by  Manufacturing  Method 59
5.1  Market  Overview  by  Manufacturing  Method 59
5.2  Subtraction  Process  (SP) 61
5.3  Addition  Process  (AP) 62
5.4  Modified  Semi-additive  Process  (MSAP) 63
6  Segmentation  of  Global  Market  by  Bonding  Technology 64
6.1  Market  Overview  by  Bonding  Technology 64
6.2  Wire  Bonding 66
6.3  FC  Bonding 68
6.4  Tape  Automated  Bonding  (TAB) 70
7  Segmentation  of  Global  Market  by  Application 71
7.1  Market  Overview  by  Application 71
7.2  Mobile  and  Consumer  Electronics 73
7.3  Automotive  and  Transportation 74
7.4  IT  and  Telecom 75
7.5  Other  Applications 76
8  Segmentation  of  Global  Market  by  Region 77
8.1  Geographic  Market  Overview  2021-2031 77
8.2  North  America  Market  2021-2031  by  Country 81
8.2.1  Overview  of  North  America  Market 81
8.2.2  U.S. 85
8.2.3  Canada 88
8.2.4  Mexico 90
8.3  European  Market  2021-2031  by  Country 92
8.3.1  Overview  of  European  Market 92
8.3.2  Germany 96
8.3.3  U.K. 98
8.3.4  France 100
8.3.5  Spain 102
8.3.6  Italy 104
8.3.7  Netherlands 106
8.3.8  Rest  of  European  Market 108
8.4  Asia-Pacific  Market  2021-2031  by  Country/Region 110
8.4.1  Overview  of  Asia-Pacific  Market 110
8.4.2  Japan 114
8.4.3  China 117
8.4.4  Australia 119
8.4.5  Taiwan 121
8.4.6  South  Korea 123
8.4.7  Rest  of  APAC  Region 125
8.5  South  America  Market  2021-2031  by  Country 127
8.5.1  Argentina 130
8.5.2  Brazil 132
8.5.3  Chile 134
8.5.4  Rest  of  South  America  Market 136
8.6  MEA  Market  2021-2031  by  Country 137
8.6.1  UAE 140
8.6.2  Saudi  Arabia 142
8.6.3  South  Africa 144
8.6.4  Other  National  Markets 146
9  Competitive  Landscape 147
9.1  Overview  of  Key  Vendors 147
9.2  New  Product  Launch,  Partnership,  Investment,  and  M&A 150
9.3  Company  Profiles 151
ASE  Group 151
AT&S  Austria  Technologie  &  Systemtechnik  AG 153
Fujitsu  Ltd. 156
IBIDEN  Co.,  Ltd. 160
Kinsus  Interconnect  Technology  Corp. 162
Korea  Circuit  Co.,  Ltd. 164
KYOCERA  Corporation 165
LG  Innotek  Co.,  Ltd. 168
Nan  Ya  PCB  Co.,  Ltd.  (Nan  Ya  Plastics  Corporation) 169
Shenzhen  Fastprint  Circuit  Tech 170
Shinko  Electric  Industries  Co.,  Ltd. 171
Siliconware  Precision  Industries  Co.,  Ltd. 174
STATS  ChipPAC  Pte.  Ltd.  (JCET  GROUP  CO.  LTD) 176
TTM  Technologies  Inc. 179
Unimicron  Corporation 182
Zhen  Ding  Technology  Holding  Ltd. 185
Zhuhai  ACCESS  Semiconductor 186
RELATED  REPORTS 187
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