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Asia Pacific Advanced IC Substrates Market


Asia Pacific Advanced IC Substrates Market 2021-2031 by Packaging Type (FC BGA, FC CSP, Others), Material Type (Rigid, Flex, Ceramic), Manufacturing Method (SP, AP, MSAP), Bonding Technology (Wire Bonding, FC Bonding, TAB), Application (Mobile and Consumer Electronics, Automotive and Transportation, IT and Telecom, Others), and Country: Trend Forecast and Growth Opportunity

Report code: SDMRCO1651991 | Industry: Computers, Electrics & Communications | Published On: 9/30/2022


Asia Pacific advanced IC substrates market will grow by 7.4% annually with a total addressable market cap of $ 99,969.7 million over 2022-2031, driven by the rising adoption of advanced substrates in manufacturing of electronics, the increasing prevalence and functionality of consumer electronic products such as smart devices and smart wearables, and the increasing penetration of advanced technologies such as 5G and IoT connected devices.
Highlighted with 30 tables and 49 figures, this 109-page report “Asia Pacific Advanced IC Substrates Market 2021-2031 by Packaging Type (FC BGA, FC CSP, Others), Material Type (Rigid, Flex, Ceramic), Manufacturing Method (SP, AP, MSAP), Bonding Technology (Wire Bonding, FC Bonding, TAB), Application (Mobile and Consumer Electronics, Automotive and Transportation, IT and Telecom, Others), and Country: Trend Forecast and Growth Opportunity.” is based on a comprehensive research of the entire Asia Pacific advanced IC substrates market and all its sub-segments through extensively detailed classifications. Profound analysis and assessment are generated from premium primary and secondary information sources with inputs derived from industry professionals across the value chain. The report is based on studies on 2019-2021 and provides forecast from 2022 till 2031 with 2021 as the base year. (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)

In-depth qualitative analyses include identification and investigation of the following aspects:
• Market Structure
• Growth Drivers
• Restraints and Challenges
• Emerging Product Trends & Market Opportunities
• Porter’s Fiver Forces
The trend and outlook of Asia Pacific market is forecast in optimistic, balanced, and conservative view by taking into account of COVID-19 and Russia-Ukraine conflict. The balanced (most likely) projection is used to quantify Asia Pacific advanced IC substrates market in every aspect of the classification from perspectives of Packaging Type, Material Type, Manufacturing Method, Bonding Technology, Application, and Country.

Based on Packaging Type, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
• FC BGA
• FC CSP
• Other Packaging Types

Based on Material Type, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
• Rigid Integrated Circuit Substrate
• Flex Integrated Circuit Substrate
• Ceramic Integrated Circuit Substrate

By Manufacturing Method, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
• Subtraction Process (SP)
• Addition Process (AP)
• Modified Semi-additive Process (MSAP)

By Bonding Technology, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
• Wire Bonding
• FC Bonding
• Tape Automated Bonding (TAB)

By Application, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
• Mobile and Consumer Electronics
• Automotive and Transportation
• IT and Telecom
• Other Applications

Geographically, the following national/local markets are fully investigated:
• Japan
• China
• South Korea
• Australia
• Taiwan
• Rest of APAC (further segmented into Malaysia, Singapore, Indonesia, Thailand, New Zealand, Vietnam, India, and Philippines)
For each key country, detailed analysis and data for annual revenue ($ mn) are available for 2021-2031. The breakdown of national markets by Packaging Type, Material Type and Application over the forecast years are also included.

The report also covers current competitive scenario and the predicted trend; and profiles key vendors including market leaders and important emerging players.
Selected Key Players:
ASE Group
AT&S Austria Technologie & Systemtechnik AG
Fujitsu Ltd.
IBIDEN Co., Ltd.
Kinsus Interconnect Technology Corp.
Korea Circuit Co., Ltd.
KYOCERA Corporation
LG Innotek Co., Ltd.
Nan Ya PCB Co., Ltd. (Nan Ya Plastics Corporation)
Shenzhen Fastprint Circuit Tech
Shinko Electric Industries Co., Ltd.
Siliconware Precision Industries Co., Ltd.
STATS ChipPAC Pte. Ltd.
TTM Technologies Inc.
Unimicron Corporation
Zhen Ding Technology Holding Ltd.
Zhuhai ACCESS Semiconductor
(Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)

1  Introduction 7
1.1  Industry  Definition  and  Research  Scope 7
1.1.1  Industry  Definition 7
1.1.2  Research  Scope 8
1.2  Research  Methodology 11
1.2.1  Overview  of  Market  Research  Methodology 11
1.2.2  Market  Assumption 12
1.2.3  Secondary  Data 12
1.2.4  Primary  Data 12
1.2.5  Data  Filtration  and  Model  Design 13
1.2.6  Market  Size/Share  Estimation 14
1.2.7  Research  Limitations 15
1.3  Executive  Summary 16
2  Market  Overview  and  Dynamics 19
2.1  Market  Size  and  Forecast 19
2.1.1  Impact  of  COVID-19  on  World  Economy 20
2.1.2  Impact  of  COVID-19  on  the  Market 25
2.2  Major  Growth  Drivers 27
2.3  Market  Restraints  and  Challenges 32
2.4  Emerging  Opportunities  and  Market  Trends 35
2.5  Porter’s  Fiver  Forces  Analysis 39
3  Segmentation  of  Asia  Pacific  Market  by  Packaging  Type 43
3.1  Market  Overview  by  Packaging  Type 43
3.2  FC  BGA 45
3.3  FC  CSP 46
3.4  Other  Packaging  Types 47
4  Segmentation  of  Asia  Pacific  Market  by  Material  Type 48
4.1  Market  Overview  by  Material  Type 48
4.2  Rigid  Integrated  Circuit  Substrate 50
4.3  Flex  Integrated  Circuit  Substrate 51
4.4  Ceramic  Integrated  Circuit  Substrate 52
5  Segmentation  of  Asia  Pacific  Market  by  Manufacturing  Method 53
5.1  Market  Overview  by  Manufacturing  Method 53
5.2  Subtraction  Process  (SP) 55
5.3  Addition  Process  (AP) 56
5.4  Modified  Semi-additive  Process  (MSAP) 57
6  Segmentation  of  Asia  Pacific  Market  by  Bonding  Technology 58
6.1  Market  Overview  by  Bonding  Technology 58
6.2  Wire  Bonding 60
6.3  FC  Bonding 62
6.4  Tape  Automated  Bonding  (TAB) 64
7  Segmentation  of  Asia  Pacific  Market  by  Application 65
7.1  Market  Overview  by  Application 65
7.2  Mobile  and  Consumer  Electronics 67
7.3  Automotive  and  Transportation 68
7.4  IT  and  Telecom 69
7.5  Other  Applications 70
8  Asia-Pacific  Market  2021-2031  by  Country/Region 71
8.1  Overview  of  Asia-Pacific  Market 71
8.2  Japan 74
8.3  China 77
8.4  Australia 79
8.5  Taiwan 81
8.6  South  Korea 83
8.7  Rest  of  APAC  Region 85
9  Competitive  Landscape 87
9.1  Overview  of  Key  Vendors 87
9.2  New  Product  Launch,  Partnership,  Investment,  and  M&A 90
9.3  Company  Profiles 91
ASE  Group 91
AT&S  Austria  Technologie  &  Systemtechnik  AG 93
Fujitsu  Ltd. 94
IBIDEN  Co.,  Ltd. 95
Kinsus  Interconnect  Technology  Corp. 96
Korea  Circuit  Co.,  Ltd. 97
KYOCERA  Corporation 98
LG  Innotek  Co.,  Ltd. 99
Nan  Ya  PCB  Co.,  Ltd.  (Nan  Ya  Plastics  Corporation) 100
Shenzhen  Fastprint  Circuit  Tech 101
Shinko  Electric  Industries  Co.,  Ltd. 102
Siliconware  Precision  Industries  Co.,  Ltd. 103
STATS  ChipPAC  Pte.  Ltd. 104
TTM  Technologies  Inc. 105
Unimicron  Corporation 106
Zhen  Ding  Technology  Holding  Ltd. 107
Zhuhai  ACCESS  Semiconductor 108
RELATED  REPORTS 109
List of Tables:

Table 1. Snapshot of Asia Pacific Advanced IC Substrates Market in Balanced Perspective, 2021-2031 17
Table 2. World Economic Outlook, 2021-2031 22
Table 3. World Economic Outlook, 2021-2023 23
Table 4. World Semiconductor Market, 2021-2031, $ bn 30
Table 5. Main Product Trends and Market Opportunities in Asia Pacific Advanced IC Substrates Market 35
Table 6. Asia Pacific Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn 43
Table 7. Asia Pacific Advanced IC Substrates Market by Material Type, 2021-2031, $ mn 48
Table 8. Asia Pacific Advanced IC Substrates Market by Manufacturing Method, 2021-2031, $ mn 53
Table 9. Asia Pacific Advanced IC Substrates Market by Bonding Technology, 2021-2031, $ mn 58
Table 10. Asia Pacific Advanced IC Substrates Market by Application, 2021-2031, $ mn 65
Table 11. APAC Advanced IC Substrates Market by Country/Region, 2021-2031, $ mn 72
Table 12. Japan Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn 76
Table 13. Japan Advanced IC Substrates Market by Material Type, 2021-2031, $ mn 76
Table 14. Japan Advanced IC Substrates Market by Application, 2021-2031, $ mn 76
Table 15. China Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn 78
Table 16. China Advanced IC Substrates Market by Material Type, 2021-2031, $ mn 78
Table 17. China Advanced IC Substrates Market by Application, 2021-2031, $ mn 78
Table 18. Australia Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn 80
Table 19. Australia Advanced IC Substrates Market by Material Type, 2021-2031, $ mn 80
Table 20. Australia Advanced IC Substrates Market by Application, 2021-2031, $ mn 80
Table 21. Taiwan Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn 82
Table 22. Taiwan Advanced IC Substrates Market by Material Type, 2021-2031, $ mn 82
Table 23. Taiwan Advanced IC Substrates Market by Application, 2021-2031, $ mn 82
Table 24. South Korea Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn 84
Table 25. South Korea Advanced IC Substrates Market by Material Type, 2021-2031, $ mn 84
Table 26. South Korea Advanced IC Substrates Market by Application, 2021-2031, $ mn 84
Table 27. Advanced IC Substrates Market in Rest of APAC by Country/Region, 2021-2031, $ mn 86
Table 28. ASE Group: Company Snapshot 91
Table 29. ASE Group: Business Segmentation 92
Table 30. ASE Group: Product Portfolio 92
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