Europe advanced IC substrates market was valued at $562.7 million in 2022 and will grow by 5.4% annually over 2022-2031, driven by the rising adoption of advanced substrates in manufacturing of electronics, the increasing prevalence and functionality of consumer electronic products sch as smart devices and smart wearables, and the increasing penetration of advanced technologies such as 5G and IoT connected devices.
Highlighted with 61 tables and 50 figures, this 132-page report “Europe Advanced IC Substrates Market 2022-2031 by Packaging Type (FC BGA, FC CSP, Others), Material Type (Rigid, Flex, Ceramic), Manufacturing Method (SP, AP, MSAP), Bonding Technology (Wire Bonding, FC Bonding, TAB), Application (Mobile and Consumer Electronics, Automotive and Transportation, IT and Telecom, Others), and Country: Trend Forecast and Growth Opportunity” is based on a comprehensive research of the entire Europe advanced IC substrates market and all its sub-segments through extensively detailed classifications. Profound analysis and assessment are generated from premium primary and secondary information sources with inputs derived from industry professionals across the value chain. The report is based on studies on 2021-2022 and provides forecast from 2023 till 2031 with 2022 as the base year. (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)
In-depth qualitative analyses include identification and investigation of the following aspects:
• Market Structure
• Growth Drivers
• Restraints and Challenges
• Emerging Product Trends & Market Opportunities
• Porter’s Fiver Forces
The trend and outlook of Europe market is forecast in optimistic, balanced, and conservative view by taking into account of COVID-19 and Russia-Ukraine conflict. The balanced (most likely) projection is used to quantify Europe advanced IC substrates market in every aspect of the classification from perspectives of Packaging Type, Material Type, Manufacturing Method, Bonding Technology, Application, and Country.
Based on Packaging Type, the Europe market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section.
• FC BGA
• FC CSP
• Other Packaging Types
Based on Material Type, the Europe market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section.
• Rigid Integrated Circuit Substrate
• Flex Integrated Circuit Substrate
• Ceramic Integrated Circuit Substrate
By Manufacturing Method, the Europe market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section.
• Subtraction Process (SP)
• Addition Process (AP)
• Modified Semi-additive Process (MSAP)
By Bonding Technology, the Europe market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section.
• Wire Bonding
• FC Bonding
• Tape Automated Bonding (TAB)
By Application, the Europe market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section.
• Mobile and Consumer Electronics
• Automotive and Transportation
• IT and Telecom
• Other Applications
Geographically, the following national/local markets are fully investigated:
• Germany
• UK
• France
• Spain
• Italy
• Netherlands
• Rest of Europe (further segmented into Russia, Switzerland, Poland, Sweden, Belgium, Austria, Ireland, Norway, Denmark, and Finland)
For each key country, detailed analysis and data for annual revenue ($ mn) are available for 2022-2031. The breakdown of national markets by Packaging Type, Material Type and Application over the forecast years is also included.
The report also covers the current competitive scenario and the predicted trend; and profiles key vendors including market leaders and important emerging players.
Selected Key Players:
ASE Group
AT&S Austria Technologie & Systemtechnik AG
Fujitsu Ltd.
IBIDEN Co., Ltd.
Kinsus Interconnect Technology Corp.
Korea Circuit Co., Ltd.
KYOCERA Corporation
LG Innotek Co., Ltd.
Nan Ya PCB Co., Ltd. (Nan Ya Plastics Corporation)
Shenzhen Fastprint Circuit Tech
Shinko Electric Industries Co., Ltd.
Siliconware Precision Industries Co., Ltd.
STATS ChipPAC Pte. Ltd. (JCET GROUP CO. LTD)
TTM Technologies Inc.
Unimicron Corporation
Zhen Ding Technology Holding Ltd.
Zhuhai ACCESS Semiconductor
(Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)
1 Introduction 8
1.1 Industry Definition and Research Scope 8
1.1.1 Industry Definition 8
1.1.2 Research Scope 9
1.2 Research Methodology 12
1.2.1 Overview of Market Research Methodology 12
1.2.2 Market Assumption 13
1.2.3 Secondary Data 13
1.2.4 Primary Data 13
1.2.5 Data Filtration and Model Design 14
1.2.6 Market Size/Share Estimation 15
1.2.7 Research Limitations 16
1.3 Executive Summary 17
2 Market Overview and Dynamics 20
2.1 Market Size and Forecast 20
2.1.1 Impact of COVID-19 on World Economy 22
2.1.2 Impact of COVID-19 on the Market 25
2.1.3 Impact of Russia-Ukraine Conflict: War Slows Economic Recovery 27
2.2 Major Growth Drivers 31
2.3 Market Restraints and Challenges 36
2.4 Emerging Opportunities and Market Trends 39
2.5 Porter’s Fiver Forces Analysis 43
3 Segmentation of Europe Market by Packaging Type 47
3.1 Market Overview by Packaging Type 47
3.2 FC BGA 49
3.3 FC CSP 50
3.4 Other Packaging Types 51
4 Segmentation of Europe Market by Material Type 52
4.1 Market Overview by Material Type 52
4.2 Rigid Integrated Circuit Substrate 54
4.3 Flex Integrated Circuit Substrate 55
4.4 Ceramic Integrated Circuit Substrate 56
5 Segmentation of Europe Market by Manufacturing Method 57
5.1 Market Overview by Manufacturing Method 57
5.2 Subtraction Process (SP) 59
5.3 Addition Process (AP) 60
5.4 Modified Semi-additive Process (MSAP) 61
6 Segmentation of Europe Market by Bonding Technology 62
6.1 Market Overview by Bonding Technology 62
6.2 Wire Bonding 64
6.3 FC Bonding 66
6.4 Tape Automated Bonding (TAB) 68
7 Segmentation of Europe Market by Application 69
7.1 Market Overview by Application 69
7.2 Mobile and Consumer Electronics 71
7.3 Automotive and Transportation 72
7.4 IT and Telecom 73
7.5 Other Applications 74
8 European Market 2021-2031 by Country 75
8.1 Overview of European Market 75
8.2 Germany 78
8.3 U.K. 80
8.4 France 82
8.5 Spain 84
8.6 Italy 86
8.7 Netherlands 88
8.8 Rest of European Market 90
9 Competitive Landscape 92
9.1 Overview of Key Vendors 92
9.2 New Product Launch, Partnership, Investment, and M&A 95
9.3 Company Profiles 96
ASE Group 96
AT&S Austria Technologie & Systemtechnik AG 98
Fujitsu Ltd. 101
IBIDEN Co., Ltd. 105
Kinsus Interconnect Technology Corp. 107
Korea Circuit Co., Ltd. 109
KYOCERA Corporation 110
LG Innotek Co., Ltd. 113
Nan Ya PCB Co., Ltd. (Nan Ya Plastics Corporation) 114
Shenzhen Fastprint Circuit Tech 115
Shinko Electric Industries Co., Ltd. 116
Siliconware Precision Industries Co., Ltd. 119
STATS ChipPAC Pte. Ltd. (JCET GROUP CO. LTD) 121
TTM Technologies Inc. 124
Unimicron Corporation 127
Zhen Ding Technology Holding Ltd. 130
Zhuhai ACCESS Semiconductor 131
RELATED REPORTS 132
List of Tables:
Table 1. Snapshot of Europe Advanced IC Substrates Market in Balanced Perspective, 2021-2031 18
Table 2. World Economic Outlook, 2021-2031 23
Table 3. World Economic Outlook, 2021-2023 24
Table 4. Scenarios for Economic Impact of Ukraine Crisis 28
Table 5. World Semiconductor Market, 2021-2031, $ bn 34
Table 6. Main Product Trends and Market Opportunities in Europe Advanced IC Substrates Market 39
Table 7. Europe Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn 47
Table 8. Europe Advanced IC Substrates Market by Material Type, 2021-2031, $ mn 52
Table 9. Europe Advanced IC Substrates Market by Manufacturing Method, 2021-2031, $ mn 57
Table 10. Europe Advanced IC Substrates Market by Bonding Technology, 2021-2031, $ mn 62
Table 11. Europe Advanced IC Substrates Market by Application, 2021-2031, $ mn 69
Table 12. Europe Advanced IC Substrates Market by Country, 2021-2031, $ mn 77
Table 13. Germany Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn 79
Table 14. Germany Advanced IC Substrates Market by Material Type, 2021-2031, $ mn 79
Table 15. Germany Advanced IC Substrates Market by Application, 2021-2031, $ mn 79
Table 16. U.K. Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn 81
Table 17. U.K. Advanced IC Substrates Market by Material Type, 2021-2031, $ mn 81
Table 18. U.K. Advanced IC Substrates Market by Application, 2021-2031, $ mn 81
Table 19. France Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn 83
Table 20. France Advanced IC Substrates Market by Material Type, 2021-2031, $ mn 83
Table 21. France Advanced IC Substrates Market by Application, 2021-2031, $ mn 83
Table 22. Spain Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn 85
Table 23. Spain Advanced IC Substrates Market by Material Type, 2021-2031, $ mn 85
Table 24. Spain Advanced IC Substrates Market by Application, 2021-2031, $ mn 85
Table 25. Italy Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn 87
Table 26. Italy Advanced IC Substrates Market by Material Type, 2021-2031, $ mn 87
Table 27. Italy Advanced IC Substrates Market by Application, 2021-2031, $ mn 87
Table 28. Netherlands Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn 89
Table 29. Netherlands Advanced IC Substrates Market by Material Type, 2021-2031, $ mn 89
Table 30. Netherlands Advanced IC Substrates Market by Application, 2021-2031, $ mn 89
Table 31. Advanced IC Substrates Market in Rest of Europe by Country, 2021-2031, $ mn 91
Table 32. ASE Group: Company Snapshot 96
Table 33. ASE Group: Business Segmentation 97
Table 34. ASE Group: Product Portfolio 97
Table 35. AT&S Austria Technologie & Systemtechnik AG: Company Snapshot 98
Table 36. AT&S Austria Technologie & Systemtechnik AG: Breakdown of Revenue by Business Segment 99
Table 37. Fujitsu Limited: Company Snapshot 101
Table 38. Fujitsu Limited: Business Segmentation and Share 102
Table 39. Fujitsu Limited: Revenue Distribution by Region in 2021 103
Table 40. IBIDEN Co., Ltd.: Company Snapshot 105
Table 41. IBIDEN Co., Ltd.: Breakdown of Revenue by Business Segment 106
Table 42. Kinsus Interconnect Technology Corp..: Company Snapshot 107
Table 43. Kinsus Interconnect Technology Corp.: Breakdown of Revenue by Business Segment 108
Table 44. Korea Circuit Co., Ltd.: Company Snapshot 109
Table 45. KYOCERA Corporation: Company Snapshot 110
Table 46. KYOCERA Corporation: Breakdown of Revenue by Business Segment 111
Table 47. LG Innotek Co., Ltd.: Company Snapshot 113
Table 48. Nan Ya PCB Co., Ltd.: Company Snapshot 114
Table 49. Shenzhen Fastprint Circuit Tech: Company Snapshot 115
Table 50. Shinko Electric Industries Co., Ltd.: Company Snapshot 116
Table 51. Shinko Electric Industries Co., Ltd.: Breakdown of Revenue by Business Segment 117
Table 52. Siliconware Precision Industries Co., Ltd.: Company Snapshot 119
Table 53. Siliconware Precision Industries Co., Ltd.: Breakdown of Revenue by Business Segment 120
Table 54. STATS ChipPAC Pte. Ltd.: Company Snapshot 121
Table 55. STATS ChipPAC Pte. Ltd.: Breakdown of Revenue by Business Segment 122
Table 56. TTM Technologies Inc.: Company Snapshot 124
Table 57. TTM Technologies Inc.: Breakdown of Revenue by Business Segment 125
Table 58. Unimicron Corporation: Company Snapshot 127
Table 59. Unimicron Corporation: Breakdown of Revenue by Business Segment 128
Table 60. Zhen Ding Technology Holding Ltd.: Company Snapshot 130
Table 61. Zhuhai ACCESS Semiconductor: Company Snapshot 131
