Europe advanced packaging market was valued at $3,029.1 million in 2021 and will grow by 8.9% annually over 2021-2031 owing to the rising demand for consumer electronics, the growing demand for high-end chips, and the cost reduction and improved efficiency brought by advancing packaging.
Highlighted with 30 tables and 42 figures, this 99-page report “Europe Advanced Packaging Market 2021-2031 by Product Type (Active Packaging, Smart and Intelligent Packaging), Packaging Platform (Flip-Chip Ball Grid Array, Flip Chip CSP, Wafer Level CSP, 2.5D/3D IC, Fo-WLP, Embedded Die, Fi-WLP), End User (Consumer Electronics, IT and Telecom, Automotive and Transportation, Industrial Sector), and Country: Trend Forecast and Growth Opportunity” is based on a comprehensive research of the entire Europe advanced packaging market and all its sub-segments through extensively detailed classifications. Profound analysis and assessment are generated from premium primary and secondary information sources with inputs derived from industry professionals across the value chain. The report is based on studies on 2018-2021 and provides forecast from 2022 till 2031 with 2021 as the base year. (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)
In-depth qualitative analyses include identification and investigation of the following aspects:
• Market Structure
• Growth Drivers
• Restraints and Challenges
• Emerging Product Trends & Market Opportunities
• Porter’s Fiver Forces
The trend and outlook of Europe market is forecast in optimistic, balanced, and conservative view by taking into account of COVID-19. The balanced (most likely) projection is used to quantify Europe advanced packaging market in every aspect of the classification from perspectives of Product Type, Packaging Platform, End User, and Country.
Based on Product Type, the Europe market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
• Active Packaging
• Smart and Intelligent Packaging
Based on Packaging Platform, the Europe market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
• Flip-Chip Ball Grid Array
• Flip Chip CSP
• Wafer Level CSP
• 2.5D/3D Integrated Circuit
• Fan Out Wafer Level Package (Fo-WLP)
• Embedded Die
• Fan In Wafer Level Package (Fi-WLP)
• Other Packaging Platforms
By End User, the Europe market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
• Consumer Electronics
• IT and Telecom
• Automotive and Transportation
• Industrial Sector
• Healthcare and Life Science
• Aerospace and Defense
• Other End Users
Geographically, the following national/local markets are fully investigated:
• Germany
• UK
• France
• Spain
• Italy
• Russia
• Rest of Europe (further segmented into Netherlands, Switzerland, Poland, Sweden, Belgium, Austria, Ireland, Norway, Denmark, and Finland)
For each key country, detailed analysis and data for annual revenue ($ mn) are available for 2021-2031. The breakdown of the regional market by country and split of key national markets by Product Type, Packaging Platform, and End User over the forecast years are also included.
The report also covers current competitive scenario and the predicted trend; and profiles key vendors including market leaders and important emerging players.
Selected Key Players:
Advanced Semiconductor Engineering Inc.
Amkor Technology, Inc.
Brewer Science, Inc.
Chipbond Technology Corporation
Intel Corporation
International Business Machines Corporation (IBM)
Microchip Technology, Inc.
Qualcomm Technologies, Inc.
Renesas Electronics Corporation
Samsung Electronics Co., Ltd.
STATS ChipPAC Pte. Ltd
SÜSS Microtec Se
Taiwan Semiconductor Manufacturing Company, Limited
Texas Instruments, Inc.
Universal Instruments Corporation
(Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)
1 Introduction 7
1.1 Industry Definition and Research Scope 7
1.1.1 Industry Definition 7
1.1.2 Research Scope 8
1.2 Research Methodology 11
1.2.1 Overview of Market Research Methodology 11
1.2.2 Market Assumption 12
1.2.3 Secondary Data 12
1.2.4 Primary Data 12
1.2.5 Data Filtration and Model Design 13
1.2.6 Market Size/Share Estimation 14
1.2.7 Research Limitations 15
1.3 Executive Summary 16
2 Market Overview and Dynamics 19
2.1 Market Size and Forecast 19
2.1.1 Impact of COVID-19 on World Economy 20
2.1.2 Impact of COVID-19 on the Market 22
2.2 Major Growth Drivers 24
2.3 Market Restraints and Challenges 27
2.4 Emerging Opportunities and Market Trends 30
2.5 Porter’s Fiver Forces Analysis 34
3 Segmentation of Europe Market by Product Type 38
3.1 Market Overview by Product Type 38
3.2 Active Packaging 40
3.3 Smart and Intelligent Packaging 41
4 Segmentation of Europe Market by Packaging Platform 42
4.1 Market Overview by Packaging Platform 42
4.2 Flip-Chip Ball Grid Array 44
4.3 Flip Chip CSP 45
4.4 Wafer Level CSP 46
4.5 2.5D/3D Integrated Circuit 47
4.6 Fan Out Wafer Level Package (Fo-WLP) 48
4.7 Embedded Die 49
4.8 Fan In Wafer Level Package (Fi-WLP) 50
4.9 Other Packaging Platforms 51
5 Segmentation of Europe Market by End User 52
5.1 Market Overview by End User 52
5.2 Consumer Electronics 54
5.3 IT and Telecom 55
5.4 Automotive and Transportation 56
5.5 Industrial Sector 57
5.6 Healthcare and Life Science 58
5.7 Aerospace and Defense 59
5.8 Other End Users 60
6 European Market 2021-2031 by Country 61
6.1 Overview of European Market 61
6.2 Germany 64
6.3 U.K. 66
6.4 France 69
6.5 Spain 71
6.6 Italy 73
6.7 Russia 75
6.8 Rest of European Market 77
7 Competitive Landscape 79
7.1 Overview of Key Vendors 79
7.2 New Product Launch, Partnership, Investment, and M&A 82
7.3 Company Profiles 83
Advanced Semiconductor Engineering Inc. 83
Amkor Technology, Inc. 85
Brewer Science, Inc. 86
Chipbond Technology Corporation 87
Intel Corporation 88
International Business Machines Corporation (IBM) 89
Microchip Technology, Inc. 90
Qualcomm Technologies, Inc. 91
Renesas Electronics Corporation 92
Samsung Electronics Co., Ltd. 93
STATS ChipPAC Pte. Ltd 94
SÜSS Microtec Se 95
Taiwan Semiconductor Manufacturing Company, Limited 96
Texas Instruments, Inc. 97
Universal Instruments Corporation 98
RELATED REPORTS 99
List of Tables:
Table 1. Snapshot of Europe Advanced Packaging Market in Balanced Perspective, 2021-2031 17
Table 2. World Economic Outlook, 2021-2031 21
Table 3. World Electrical and Electronics Market, 2021-2031, $ bn 26
Table 4. Main Product Trends and Market Opportunities in Europe Advanced Packaging Market 30
Table 5. Europe Advanced Packaging Market by Product Type, 2021-2031, $ mn 38
Table 6. Europe Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 42
Table 7. Europe Advanced Packaging Market by End User, 2021-2031, $ mn 52
Table 8. Europe Advanced Packaging Market by Country, 2021-2031, $ mn 63
Table 9. Germany Advanced Packaging Market by Product Type, 2021-2031, $ mn 65
Table 10. Germany Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 65
Table 11. Germany Advanced Packaging Market by End User, 2021-2031, $ mn 65
Table 12. U.K. Advanced Packaging Market by Product Type, 2021-2031, $ mn 68
Table 13. U.K. Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 68
Table 14. U.K. Advanced Packaging Market by End User, 2021-2031, $ mn 68
Table 15. France Advanced Packaging Market by Product Type, 2021-2031, $ mn 70
Table 16. France Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 70
Table 17. France Advanced Packaging Market by End User, 2021-2031, $ mn 70
Table 18. Spain Advanced Packaging Market by Product Type, 2021-2031, $ mn 72
Table 19. Spain Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 72
Table 20. Spain Advanced Packaging Market by End User, 2021-2031, $ mn 72
Table 21. Italy Advanced Packaging Market by Product Type, 2021-2031, $ mn 74
Table 22. Italy Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 74
Table 23. Italy Advanced Packaging Market by End User, 2021-2031, $ mn 74
Table 24. Russia Advanced Packaging Market by Product Type, 2021-2031, $ mn 76
Table 25. Russia Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 76
Table 26. Russia Advanced Packaging Market by End User, 2021-2031, $ mn 76
Table 27. Advanced Packaging Market in Rest of Europe by Country, 2021-2031, $ mn 78
Table 28. Advanced Semiconductor Engineering Inc.: Company Snapshot 83
Table 29. Advanced Semiconductor Engineering Inc.: Business Segmentation 84
Table 30. Advanced Semiconductor Engineering Inc.: Product Portfolio 84
