Global advanced IC substrates market will reach $16,953.8 million by 2031, growing by 7.1% annually over 2021-2031, driven by the rising adoption of advanced substrates in manufacturing of electronics, the increasing prevalence and functionality of consumer electronic products such as smart devices and smart wearables, and the increasing penetration of advanced technologies such as 5G and IoT connected devices.
Highlighted with 82 tables and 82 figures, this 165-page report “Global Advanced IC Substrates Market 2021-2031 by Packaging Type (FC BGA, FC CSP, Others), Material Type (Rigid, Flex, Ceramic), Manufacturing Method (SP, AP, MSAP), Bonding Technology (Wire Bonding, FC Bonding, TAB), Application (Mobile and Consumer Electronics, Automotive and Transportation, IT and Telecom, Others), and Region: Trend Forecast and Growth Opportunity.” is based on a comprehensive research of the entire global advanced IC substrates market and all its sub-segments through extensively detailed classifications. Profound analysis and assessment are generated from premium primary and secondary information sources with inputs derived from industry professionals across the value chain. The report is based on studies on 2019-2021 and provides forecast from 2022 till 2031 with 2021 as the base year. (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)
In-depth qualitative analyses include identification and investigation of the following aspects:
• Market Structure
• Growth Drivers
• Restraints and Challenges
• Emerging Product Trends & Market Opportunities
• Porter’s Fiver Forces
The trend and outlook of global market is forecast in optimistic, balanced, and conservative view by taking into account of COVID-19 and Russia-Ukraine conflict. The balanced (most likely) projection is used to quantify global advanced IC substrates market in every aspect of the classification from perspectives of Packaging Type, Material Type, Manufacturing Method, Bonding Technology, Application, and Region.
Based on Packaging Type, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
• FC BGA
• FC CSP
• Other Packaging Types
Based on Material Type, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
• Rigid Integrated Circuit Substrate
• Flex Integrated Circuit Substrate
• Ceramic Integrated Circuit Substrate
By Manufacturing Method, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
• Subtraction Process (SP)
• Addition Process (AP)
• Modified Semi-additive Process (MSAP)
By Bonding Technology, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
• Wire Bonding
• FC Bonding
• Tape Automated Bonding (TAB)
By Application, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
• Mobile and Consumer Electronics
• Automotive and Transportation
• IT and Telecom
• Other Applications
Geographically, the following regions together with the listed national/local markets are fully investigated:
• North America (U.S., Canada, and Mexico)
• Europe (Germany, UK, France, Spain, Italy, Netherlands, Rest of Europe; Rest of Europe is further segmented into Russia, Switzerland, Poland, Sweden, Belgium, Austria, Ireland, Norway, Denmark, and Finland)
• APAC (Japan, China, South Korea, Australia, Taiwan, and Rest of APAC; Rest of APAC is further segmented into Malaysia, Singapore, Indonesia, Thailand, New Zealand, Vietnam, India, and Philippines)
• South America (Brazil, Chile, Argentina, Rest of South America)
• MEA (UAE，Saudi Arabia， South Africa and Rest of MEA)
For each aforementioned region and country, detailed analysis and data for annual revenue ($ mn) are available for 2021-2031. The breakdown of all regional markets by country and split of each national market by Packaging Type, Material Type and Application over the forecast years are also included.
The report also covers current competitive scenario and the predicted trend; and profiles key vendors including market leaders and important emerging players.
Selected Key Players:
ASE Group
AT&S Austria Technologie & Systemtechnik AG
Fujitsu Ltd.
IBIDEN Co., Ltd.
Kinsus Interconnect Technology Corp.
Korea Circuit Co., Ltd.
KYOCERA Corporation
LG Innotek Co., Ltd.
Nan Ya PCB Co., Ltd. (Nan Ya Plastics Corporation)
Shenzhen Fastprint Circuit Tech
Shinko Electric Industries Co., Ltd.
Siliconware Precision Industries Co., Ltd.
STATS ChipPAC Pte. Ltd.
TTM Technologies Inc.
Unimicron Corporation
Zhen Ding Technology Holding Ltd.
Zhuhai ACCESS Semiconductor
(Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)
1 Introduction 9
1.1 Industry Definition and Research Scope 9
1.1.1 Industry Definition 9
1.1.2 Research Scope 10
1.2 Research Methodology 13
1.2.1 Overview of Market Research Methodology 13
1.2.2 Market Assumption 14
1.2.3 Secondary Data 14
1.2.4 Primary Data 14
1.2.5 Data Filtration and Model Design 15
1.2.6 Market Size/Share Estimation 16
1.2.7 Research Limitations 17
1.3 Executive Summary 18
2 Market Overview and Dynamics 21
2.1 Market Size and Forecast 21
2.1.1 Impact of COVID-19 on World Economy 22
2.1.2 Impact of COVID-19 on the Market 27
2.2 Major Growth Drivers 29
2.3 Market Restraints and Challenges 34
2.4 Emerging Opportunities and Market Trends 37
2.5 Porter’s Fiver Forces Analysis 41
3 Segmentation of Global Market by Packaging Type 45
3.1 Market Overview by Packaging Type 45
3.2 FC BGA 47
3.3 FC CSP 48
3.4 Other Packaging Types 49
4 Segmentation of Global Market by Material Type 50
4.1 Market Overview by Material Type 50
4.2 Rigid Integrated Circuit Substrate 52
4.3 Flex Integrated Circuit Substrate 53
4.4 Ceramic Integrated Circuit Substrate 54
5 Segmentation of Global Market by Manufacturing Method 55
5.1 Market Overview by Manufacturing Method 55
5.2 Subtraction Process (SP) 57
5.3 Addition Process (AP) 58
5.4 Modified Semi-additive Process (MSAP) 59
6 Segmentation of Global Market by Bonding Technology 60
6.1 Market Overview by Bonding Technology 60
6.2 Wire Bonding 62
6.3 FC Bonding 64
6.4 Tape Automated Bonding (TAB) 66
7 Segmentation of Global Market by Application 67
7.1 Market Overview by Application 67
7.2 Mobile and Consumer Electronics 69
7.3 Automotive and Transportation 70
7.4 IT and Telecom 71
7.5 Other Applications 72
8 Segmentation of Global Market by Region 73
8.1 Geographic Market Overview 2021-2031 73
8.2 North America Market 2021-2031 by Country 77
8.2.1 Overview of North America Market 77
8.2.2 U.S. 81
8.2.3 Canada 84
8.2.4 Mexico 86
8.3 European Market 2021-2031 by Country 88
8.3.1 Overview of European Market 88
8.3.2 Germany 92
8.3.3 U.K. 94
8.3.4 France 96
8.3.5 Spain 98
8.3.6 Italy 100
8.3.7 Netherlands 102
8.3.8 Rest of European Market 104
8.4 Asia-Pacific Market 2021-2031 by Country/Region 106
8.4.1 Overview of Asia-Pacific Market 106
8.4.2 Japan 110
8.4.3 China 113
8.4.4 Australia 115
8.4.5 Taiwan 117
8.4.6 South Korea 119
8.4.7 Rest of APAC Region 121
8.5 South America Market 2021-2031 by Country 123
8.5.1 Argentina 126
8.5.2 Brazil 128
8.5.3 Chile 130
8.5.4 Rest of South America Market 132
8.6 MEA Market 2021-2031 by Country 133
8.6.1 UAE 136
8.6.2 Saudi Arabia 138
8.6.3 South Africa 140
8.6.4 Other National Markets 142
9 Competitive Landscape 143
9.1 Overview of Key Vendors 143
9.2 New Product Launch, Partnership, Investment, and M&A 146
9.3 Company Profiles 147
ASE Group 147
AT&S Austria Technologie & Systemtechnik AG 149
Fujitsu Ltd. 150
IBIDEN Co., Ltd. 151
Kinsus Interconnect Technology Corp. 152
Korea Circuit Co., Ltd. 153
KYOCERA Corporation 154
LG Innotek Co., Ltd. 155
Nan Ya PCB Co., Ltd. (Nan Ya Plastics Corporation) 156
Shenzhen Fastprint Circuit Tech 157
Shinko Electric Industries Co., Ltd. 158
Siliconware Precision Industries Co., Ltd. 159
STATS ChipPAC Pte. Ltd. 160
TTM Technologies Inc. 161
Unimicron Corporation 162
Zhen Ding Technology Holding Ltd. 163
Zhuhai ACCESS Semiconductor 164
RELATED REPORTS 165
This research study incorporates the usage of extensive secondary sources, directories, and databases such as Hoovers, Factiva, Bloomberg Business week, and OneSource to identify and collect information useful for the technical, market-oriented, and commercial study of the Market. In-depth interviews were conducted with various primary respondents that include key industry participants, C-level executives of the key market players, subject matter experts (SMEs), and industry consultants to obtain and verify critical quantitative and qualitative information, as well as to assess the future market prospects. Secondary research was conducted to obtain key information about the industry’s supply chain, market’s value chain, key players, geographic markets, and key developments across market and technology-oriented perspectives. Trade analysis was conducted to analyze the import and export data of key countries and regions from various government and paid databases.
Top-down and bottom-up approaches are used to validate the Market size and estimate the market size for company, regions segments, product segments and sales channel.
Market estimations in this report are based on the marketed sale price of (excluding any discounts provided by the manufacturer, distributor, wholesaler or traders). The market share, percentage splits, and breakdowns of the product type segments are derived based on weightages assigned to each of the segments on the basis of their utilization rate and average sale price (ASP). The regional splits of the overall Market and its sub-segments are based on the percentage adoption or utilization of the given product in the respective region or country.
Major Companies in the market is identified through secondary research and their market revenues determined through primary and secondary research. Secondary research included the research of the annual and financial reports of the top Company; whereas, primary research included extensive interviews and discussions of industry experts and key opinion leaders, such as CEOs, directors, and marketing executives. The market share, percentage splits, growth rate and breakdowns of the product types are determined through secondary sources and verified through the primary sources.
All possible factors that influence the markets included in this research study have been viewed in detail, verified through primary research, and analyzed to get the final qualitative and quantitative data. The market size for top-level markets and sub-segments is normalized. Effect of inflation, regulatory & policy changes, economic downturns, or other factors are not accounted for in the market forecast. This data is combined and added with detailed inputs and analysis from SDMR and presented in this report.
After complete market engineering with calculations for market statistics and market forecasting, extensive primary research was conducted to gather information, verify, and validate the critical numbers arrived at. Both top-down and bottom-up approaches were used, along with several data triangulation methods, to perform market estimation and market forecasting for the overall market segments and sub segments listed in this report. Extensive qualitative and quantitative analysis was also done from all the data arrived at in the complete market engineering process.
Secondary sources include such as press releases, annual reports, non-profit organizations, industry associations, governmental agencies and customs data etc. This research study involves the usage of widespread secondary sources, directories, databases such as Bloomberg Business, Wind Info, Hoovers, Factiva (Dow Jones & Company), and Trading Economics, and News Network, statista, Federal Reserve Economic Data, annual reports, BIS Statistics, ICIS; company house documents; CAS (American Chemical Society); investor presentations; and SEC filings of companies. Secondary research was used to identify and collect information useful to study the technical, market-oriented, and commercial aspects of the market. It was also used to obtain important information about the top companies, market classification and segmentation according to industry trends to the bottom-most level, and key developments related to market and technology perspectives.
