North America advanced IC substrates market is projected to grow by 6.8% annually in the forecast period and reach $1,919.2 million by 2031, driven by the rising adoption of advanced substrates in manufacturing of electronics, the increasing prevalence and functionality of consumer electronic products sch as smart devices and smart wearables, and the increasing penetration of advanced technologies such as 5G and IoT connected devices.
Highlighted with 51 tables and 46 figures, this 125-page report “North America Advanced IC Substrates Market 2022-2031 by Packaging Type (FC BGA, FC CSP, Others), Material Type (Rigid, Flex, Ceramic), Manufacturing Method (SP, AP, MSAP), Bonding Technology (Wire Bonding, FC Bonding, TAB), Application (Mobile and Consumer Electronics, Automotive and Transportation, IT and Telecom, Others), and Country: Trend Forecast and Growth Opportunity” is based on a comprehensive research of the entire North America advanced IC substrates market and all its sub-segments through extensively detailed classifications. Profound analysis and assessment are generated from premium primary and secondary information sources with inputs derived from industry professionals across the value chain. The report is based on studies on 2021-2022 and provides forecast from 2023 till 2031 with 2022 as the base year. (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)
In-depth qualitative analyses include identification and investigation of the following aspects:
• Market Structure
• Growth Drivers
• Restraints and Challenges
• Emerging Product Trends & Market Opportunities
• Porter’s Fiver Forces
The trend and outlook of North America market is forecast in optimistic, balanced, and conservative view by taking into account of COVID-19 and Russia-Ukraine conflict. The balanced (most likely) projection is used to quantify North America advanced IC substrates market in every aspect of the classification from perspectives of Packaging Type, Material Type, Manufacturing Method, Bonding Technology, Application, and Country.
Based on Packaging Type, the North America market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section.
• FC BGA
• FC CSP
• Other Packaging Types
Based on Material Type, the North America market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section.
• Rigid Integrated Circuit Substrate
• Flex Integrated Circuit Substrate
• Ceramic Integrated Circuit Substrate
By Manufacturing Method, the North America market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section.
• Subtraction Process (SP)
• Addition Process (AP)
• Modified Semi-additive Process (MSAP)
By Bonding Technology, the North America market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section.
• Wire Bonding
• FC Bonding
• Tape Automated Bonding (TAB)
By Application, the North America market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section.
• Mobile and Consumer Electronics
• Automotive and Transportation
• IT and Telecom
• Other Applications
Geographically, the following national/local markets are fully investigated:
• U.S.
• Canada
• Mexico
For each key country, detailed analysis and data for annual revenue ($ mn) are available for 2022-2031. The breakdown of national markets by Packaging Type, Material Type and Application over the forecast years is also included.
The report also covers the current competitive scenario and the predicted trend; and profiles key vendors including market leaders and important emerging players.
Selected Key Players:
ASE Group
AT&S Austria Technologie & Systemtechnik AG
Fujitsu Ltd.
IBIDEN Co., Ltd.
Kinsus Interconnect Technology Corp.
Korea Circuit Co., Ltd.
KYOCERA Corporation
LG Innotek Co., Ltd.
Nan Ya PCB Co., Ltd. (Nan Ya Plastics Corporation)
Shenzhen Fastprint Circuit Tech
Shinko Electric Industries Co., Ltd.
Siliconware Precision Industries Co., Ltd.
STATS ChipPAC Pte. Ltd. (JCET GROUP CO. LTD)
TTM Technologies Inc.
Unimicron Corporation
Zhen Ding Technology Holding Ltd.
Zhuhai ACCESS Semiconductor
(Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)
1 Introduction 8
1.1 Industry Definition and Research Scope 8
1.1.1 Industry Definition 8
1.1.2 Research Scope 9
1.2 Research Methodology 12
1.2.1 Overview of Market Research Methodology 12
1.2.2 Market Assumption 13
1.2.3 Secondary Data 13
1.2.4 Primary Data 13
1.2.5 Data Filtration and Model Design 14
1.2.6 Market Size/Share Estimation 15
1.2.7 Research Limitations 16
1.3 Executive Summary 17
2 Market Overview and Dynamics 20
2.1 Market Size and Forecast 20
2.1.1 Impact of COVID-19 on World Economy 22
2.1.2 Impact of COVID-19 on the Market 25
2.1.3 Impact of Russia-Ukraine Conflict: War Slows Economic Recovery 27
2.2 Major Growth Drivers 31
2.3 Market Restraints and Challenges 36
2.4 Emerging Opportunities and Market Trends 39
2.5 Porter’s Fiver Forces Analysis 43
3 Segmentation of North America Market by Packaging Type 47
3.1 Market Overview by Packaging Type 47
3.2 FC BGA 49
3.3 FC CSP 50
3.4 Other Packaging Types 51
4 Segmentation of North America Market by Material Type 52
4.1 Market Overview by Material Type 52
4.2 Rigid Integrated Circuit Substrate 54
4.3 Flex Integrated Circuit Substrate 55
4.4 Ceramic Integrated Circuit Substrate 56
5 Segmentation of North America Market by Manufacturing Method 57
5.1 Market Overview by Manufacturing Method 57
5.2 Subtraction Process (SP) 59
5.3 Addition Process (AP) 60
5.4 Modified Semi-additive Process (MSAP) 61
6 Segmentation of North America Market by Bonding Technology 62
6.1 Market Overview by Bonding Technology 62
6.2 Wire Bonding 64
6.3 FC Bonding 66
6.4 Tape Automated Bonding (TAB) 68
7 Segmentation of North America Market by Application 69
7.1 Market Overview by Application 69
7.2 Mobile and Consumer Electronics 71
7.3 Automotive and Transportation 72
7.4 IT and Telecom 73
7.5 Other Applications 74
8 North America Market 2021-2031 by Country 75
8.1 Overview of North America Market 75
8.2 U.S. 78
8.3 Canada 81
8.4 Mexico 83
9 Competitive Landscape 85
9.1 Overview of Key Vendors 85
9.2 New Product Launch, Partnership, Investment, and M&A 88
9.3 Company Profiles 89
ASE Group 89
AT&S Austria Technologie & Systemtechnik AG 91
Fujitsu Ltd. 94
IBIDEN Co., Ltd. 98
Kinsus Interconnect Technology Corp. 100
Korea Circuit Co., Ltd. 102
KYOCERA Corporation 103
LG Innotek Co., Ltd. 106
Nan Ya PCB Co., Ltd. (Nan Ya Plastics Corporation) 107
Shenzhen Fastprint Circuit Tech 108
Shinko Electric Industries Co., Ltd. 109
Siliconware Precision Industries Co., Ltd. 112
STATS ChipPAC Pte. Ltd. (JCET GROUP CO. LTD) 114
TTM Technologies Inc. 117
Unimicron Corporation 120
Zhen Ding Technology Holding Ltd. 123
Zhuhai ACCESS Semiconductor 124
RELATED REPORTS 125
List of Tables:
Table 1. Snapshot of North America Advanced IC Substrates Market in Balanced Perspective, 2021-2031 18
Table 2. World Economic Outlook, 2021-2031 23
Table 3. World Economic Outlook, 2021-2023 24
Table 4. Scenarios for Economic Impact of Ukraine Crisis 28
Table 5. World Semiconductor Market, 2021-2031, $ bn 34
Table 6. Main Product Trends and Market Opportunities in North America Advanced IC Substrates Market 39
Table 7. North America Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn 47
Table 8. North America Advanced IC Substrates Market by Material Type, 2021-2031, $ mn 52
Table 9. North America Advanced IC Substrates Market by Manufacturing Method, 2021-2031, $ mn 57
Table 10. North America Advanced IC Substrates Market by Bonding Technology, 2021-2031, $ mn 62
Table 11. North America Advanced IC Substrates Market by Application, 2021-2031, $ mn 69
Table 12. North America Advanced IC Substrates Market by Country, 2021-2031, $ mn 76
Table 13. U.S. Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn 80
Table 14. U.S. Advanced IC Substrates Market by Material Type, 2021-2031, $ mn 80
Table 15. U.S. Advanced IC Substrates Market by Application, 2021-2031, $ mn 80
Table 16. Canada Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn 82
Table 17. Canada Advanced IC Substrates Market by Material Type, 2021-2031, $ mn 82
Table 18. Canada Advanced IC Substrates Market by Application, 2021-2031, $ mn 82
Table 19. Mexico Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn 84
Table 20. Mexico Advanced IC Substrates Market by Material Type, 2021-2031, $ mn 84
Table 21. Mexico Advanced IC Substrates Market by Application, 2021-2031, $ mn 84
Table 22. ASE Group: Company Snapshot 89
Table 23. ASE Group: Business Segmentation 90
Table 24. ASE Group: Product Portfolio 90
Table 25. AT&S Austria Technologie & Systemtechnik AG: Company Snapshot 91
Table 26. AT&S Austria Technologie & Systemtechnik AG: Breakdown of Revenue by Business Segment 92
Table 27. Fujitsu Limited: Company Snapshot 94
Table 28. Fujitsu Limited: Business Segmentation and Share 95
Table 29. Fujitsu Limited: Revenue Distribution by Region in 2021 96
Table 30. IBIDEN Co., Ltd.: Company Snapshot 98
Table 31. IBIDEN Co., Ltd.: Breakdown of Revenue by Business Segment 99
Table 32. Kinsus Interconnect Technology Corp..: Company Snapshot 100
Table 33. Kinsus Interconnect Technology Corp.: Breakdown of Revenue by Business Segment 101
Table 34. Korea Circuit Co., Ltd.: Company Snapshot 102
Table 35. KYOCERA Corporation: Company Snapshot 103
Table 36. KYOCERA Corporation: Breakdown of Revenue by Business Segment 104
Table 37. LG Innotek Co., Ltd.: Company Snapshot 106
Table 38. Nan Ya PCB Co., Ltd.: Company Snapshot 107
Table 39. Shenzhen Fastprint Circuit Tech: Company Snapshot 108
Table 40. Shinko Electric Industries Co., Ltd.: Company Snapshot 109
Table 41. Shinko Electric Industries Co., Ltd.: Breakdown of Revenue by Business Segment 110
Table 42. Siliconware Precision Industries Co., Ltd.: Company Snapshot 112
Table 43. Siliconware Precision Industries Co., Ltd.: Breakdown of Revenue by Business Segment 113
Table 44. STATS ChipPAC Pte. Ltd.: Company Snapshot 114
Table 45. STATS ChipPAC Pte. Ltd.: Breakdown of Revenue by Business Segment 115
Table 46. TTM Technologies Inc.: Company Snapshot 117
Table 47. TTM Technologies Inc.: Breakdown of Revenue by Business Segment 118
Table 48. Unimicron Corporation: Company Snapshot 120
Table 49. Unimicron Corporation: Breakdown of Revenue by Business Segment 121
Table 50. Zhen Ding Technology Holding Ltd.: Company Snapshot 123
Table 51. Zhuhai ACCESS Semiconductor: Company Snapshot 124
