Asia Pacific Advanced IC Substrates Market 2021-2031 by Packaging Type (FC BGA, FC CSP, Others), Material Type (Rigid, Flex, Ceramic), Manufacturing Method (SP, AP, MSAP), Bonding Technology (Wire Bon...

Asia Pacific advanced IC substrates market will grow by 7.4% annually with a total addressable market cap of $ 99,969.7 million over 2022-2031, driven by the rising adoption of advanced substrates in manufacturing of electronics, the increasing prevalence and functionality of consumer electronic pro...

9/30/2022 | Computers, Electrics & Communications

Europe Advanced IC Substrates Market 2021-2031 by Packaging Type (FC BGA, FC CSP, Others), Material Type (Rigid, Flex, Ceramic), Manufacturing Method (SP, AP, MSAP), Bonding Technology (Wire Bonding, ...

Europe advanced IC substrates market was valued at $540.8 million in 2021 and will grow by 5.3% annually over 2021-2031, driven by the rising adoption of advanced substrates in manufacturing of electronics, the increasing prevalence and functionality of consumer electronic products such as smart dev...

9/30/2022 | Computers, Electrics & Communications

North America Advanced IC Substrates Market 2021-2031 by Packaging Type (FC BGA, FC CSP, Others), Material Type (Rigid, Flex, Ceramic), Manufacturing Method (SP, AP, MSAP), Bonding Technology (Wire Bo...

North America advanced IC substrates market is projected to grow by 6.6% annually in the forecast period and reach $1,919.2 million by 2031, driven by the rising adoption of advanced substrates in manufacturing of electronics, the increasing prevalence and functionality of consumer electronic produc...

9/30/2022 | Computers, Electrics & Communications

Global Advanced IC Substrates Market 2021-2031 by Packaging Type (FC BGA, FC CSP, Others), Material Type (Rigid, Flex, Ceramic), Manufacturing Method (SP, AP, MSAP), Bonding Technology (Wire Bonding, ...

Global advanced IC substrates market will reach $16,953.8 million by 2031, growing by 7.1% annually over 2021-2031, driven by the rising adoption of advanced substrates in manufacturing of electronics, the increasing prevalence and functionality of consumer electronic products such as smart devices ...

2022-10-04 | Computers, Electrics & Communications

Asia Pacific Substrate-Like PCB (SLP) Market 2021-2031 by Inspection Technology (AOI, DI, AOS), Line/Space (25/25 and 30/30 μm, Less than 25/25 μm), Application (Consumer Electronics, Automotive, Medi...

Asia Pacific substrate-like PCB (SLP) market will grow by 15.6% annually with a total addressable market cap of $ 25,000.1 million over 2022-2031, driven by SLP’s ability to enable faster transmission while simultaneously giving the manufacturers more freedom to design their product, increasing R&D ...

9/30/2022 | Computers, Electrics & Communications

Europe Substrate-Like PCB (SLP) Market 2021-2031 by Inspection Technology (AOI, DI, AOS), Line/Space (25/25 and 30/30 μm, Less than 25/25 μm), Application (Consumer Electronics, Automotive, Medical, I...

Europe substrate-like PCB (SLP) market was valued at $ 94.5 million in 2021 and will grow by 11.4% annually over 2021-2031, driven by SLP’s ability to enable faster transmission while simultaneously giving the manufacturers more freedom to design their product, increasing R&D activities for technolo...

9/30/2022 | Computers, Electrics & Communications

North America Substrate-Like PCB (SLP) Market 2021-2031 by Inspection Technology (AOI, DI, AOS), Line/Space (25/25 and 30/30 μm, Less than 25/25 μm), Application (Consumer Electronics, Automotive, Med...

North America substrate-like PCB (SLP) market is projected to grow by 14.8% annually in the forecast period and reach $874.8 million by 2031, driven by SLP’s ability to enable faster transmission while simultaneously giving the manufacturers more freedom to design their product, increasing R&D activ...

9/30/2022 | Computers, Electrics & Communications

Global Substrate-Like PCB (SLP) Market 2021-2031 by Inspection Technology (AOI, DI, AOS), Line/Space (25/25 and 30/30 μm, Less than 25/25 μm), Application (Consumer Electronics, Automotive, Medical, I...

Global substrate-like PCB (SLP) market will reach $5,983.6 million by 2031, growing by 14.9% annually over 2021-2031, driven by SLP’s ability to enable faster transmission while simultaneously giving the manufacturers more freedom to design their product, increasing R&D activities for technological ...

2022-09-30 | Computers, Electrics & Communications

Global Encoder Market 2023-2033 by Encoder Type (Rotary, Linear), Signal Type (Absolute, Incremental), Technology (Optical, Magnetic, Photoelectric, Inductive), Application (Automotive, Electronics, I...

Global encoder market will reach $6.31 billion by 2033, growing by 9.3% annually over 2023-2033. The growth is driven by the increased need for high-level automation across various industries, the surging demand for automobile and consumer electronics, and technological advancements. Highlighted wi...

2024-03-08 | Computers, Electrics & Communications

Asia Pacific Consumer Internet of Things (CIoT) Market 2021-2031 by Offering (Hardware, Solutions, Services), Connectivity (Wired, Wireless), Application (Home Automation, Consumer Wearables, Consumer...

Asia Pacific consumer internet of things (CIoT) market will grow by 18.4% annually with a total addressable market cap of $706,479.6 million over 2022-2031, driven by the increasing in efficiency of CIoT products and services, rising internet penetration, increasing disposable income, surging consum...

44773 | Computers, Electrics & Communications

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Asia Pacific advanced IC substrates market will grow by 7.4% annually with a total addressable market cap of $ 99,969.7 million over 2022-2031, driven by the rising adoption of advanced substrates in manufacturing of electronics, the increasing prevalence and functionality of consumer electronic products such as smart devices and smart wearables, and the increasing penetration of advanced technologies such as 5G and IoT connected devices. Highlighted with 30 tables and 49 figures, this 109-page report “Asia Pacific Advanced IC Substrates Market 2021-2031 by Packaging Type (FC BGA, FC CSP, Others), Material Type (Rigid, Flex, Ceramic), Manufacturing Method (SP, AP, MSAP), Bonding Technology (Wire Bonding, FC Bonding, TAB), Application (Mobile and Consumer Electronics, Automotive and Transportation, IT and Telecom, Others), and Country: Trend Forecast and Growth Opportunity.” is based on a comprehensive research of the entire Asia Pacific advanced IC substrates market and all its sub-segments through extensively detailed classifications. Profound analysis and assessment are generated from premium primary and secondary information sources with inputs derived from industry professionals across the value chain. The report is based on studies on 2019-2021 and provides forecast from 2022 till 2031 with 2021 as the base year. (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.) In-depth qualitative analyses include identification and investigation of the following aspects: • Market Structure • Growth Drivers • Restraints and Challenges • Emerging Product Trends & Market Opportunities • Porter’s Fiver Forces The trend and outlook of Asia Pacific market is forecast in optimistic, balanced, and conservative view by taking into account of COVID-19 and Russia-Ukraine conflict. The balanced (most likely) projection is used to quantify Asia Pacific advanced IC substrates market in every aspect of the classification from perspectives of Packaging Type, Material Type, Manufacturing Method, Bonding Technology, Application, and Country. Based on Packaging Type, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section. • FC BGA • FC CSP • Other Packaging Types Based on Material Type, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section. • Rigid Integrated Circuit Substrate • Flex Integrated Circuit Substrate • Ceramic Integrated Circuit Substrate By Manufacturing Method, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section. • Subtraction Process (SP) • Addition Process (AP) • Modified Semi-additive Process (MSAP) By Bonding Technology, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section. • Wire Bonding • FC Bonding • Tape Automated Bonding (TAB) By Application, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section. • Mobile and Consumer Electronics • Automotive and Transportation • IT and Telecom • Other Applications Geographically, the following national/local markets are fully investigated: • Japan • China • South Korea • Australia • Taiwan • Rest of APAC (further segmented into Malaysia, Singapore, Indonesia, Thailand, New Zealand, Vietnam, India, and Philippines) For each key country, detailed analysis and data for annual revenue ($ mn) are available for 2021-2031. The breakdown of national markets by Packaging Type, Material Type and Application over the forecast years are also included. The report also covers current competitive scenario and the predicted trend; and profiles key vendors including market leaders and important emerging players. Selected Key Players: ASE Group AT&S Austria Technologie & Systemtechnik AG Fujitsu Ltd. IBIDEN Co., Ltd. Kinsus Interconnect Technology Corp. Korea Circuit Co., Ltd. KYOCERA Corporation LG Innotek Co., Ltd. Nan Ya PCB Co., Ltd. (Nan Ya Plastics Corporation) Shenzhen Fastprint Circuit Tech Shinko Electric Industries Co., Ltd. Siliconware Precision Industries Co., Ltd. STATS ChipPAC Pte. Ltd. TTM Technologies Inc. Unimicron Corporation Zhen Ding Technology Holding Ltd. Zhuhai ACCESS Semiconductor (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.) ...

9/30/2022

Europe advanced IC substrates market was valued at $540.8 million in 2021 and will grow by 5.3% annually over 2021-2031, driven by the rising adoption of advanced substrates in manufacturing of electronics, the increasing prevalence and functionality of consumer electronic products such as smart devices and smart wearables, and the increasing penetration of advanced technologies such as 5G and IoT connected devices. Highlighted with 33 tables and 50 figures, this 110-page report “Europe Advanced IC Substrates Market 2021-2031 by Packaging Type (FC BGA, FC CSP, Others), Material Type (Rigid, Flex, Ceramic), Manufacturing Method (SP, AP, MSAP), Bonding Technology (Wire Bonding, FC Bonding, TAB), Application (Mobile and Consumer Electronics, Automotive and Transportation, IT and Telecom, Others), and Country: Trend Forecast and Growth Opportunity.” is based on a comprehensive research of the entire Europe advanced IC substrates market and all its sub-segments through extensively detailed classifications. Profound analysis and assessment are generated from premium primary and secondary information sources with inputs derived from industry professionals across the value chain. The report is based on studies on 2019-2021 and provides forecast from 2022 till 2031 with 2021 as the base year. (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.) In-depth qualitative analyses include identification and investigation of the following aspects: • Market Structure • Growth Drivers • Restraints and Challenges • Emerging Product Trends & Market Opportunities • Porter’s Fiver Forces The trend and outlook of Europe market is forecast in optimistic, balanced, and conservative view by taking into account of COVID-19 and Russia-Ukraine conflict. The balanced (most likely) projection is used to quantify Europe advanced IC substrates market in every aspect of the classification from perspectives of Packaging Type, Material Type, Manufacturing Method, Bonding Technology, Application, and Country. Based on Packaging Type, the Europe market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section. • FC BGA • FC CSP • Other Packaging Types Based on Material Type, the Europe market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section. • Rigid Integrated Circuit Substrate • Flex Integrated Circuit Substrate • Ceramic Integrated Circuit Substrate By Manufacturing Method, the Europe market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section. • Subtraction Process (SP) • Addition Process (AP) • Modified Semi-additive Process (MSAP) By Bonding Technology, the Europe market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section. • Wire Bonding • FC Bonding • Tape Automated Bonding (TAB) By Application, the Europe market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section. • Mobile and Consumer Electronics • Automotive and Transportation • IT and Telecom • Other Applications Geographically, the following national/local markets are fully investigated: • Germany • UK • France • Spain • Italy • Netherlands • Rest of Europe (further segmented into Russia, Switzerland, Poland, Sweden, Belgium, Austria, Ireland, Norway, Denmark, and Finland) For each key country, detailed analysis and data for annual revenue ($ mn) are available for 2021-2031. The breakdown of national markets by Packaging Type, Material Type and Application over the forecast years are also included. The report also covers current competitive scenario and the predicted trend; and profiles key vendors including market leaders and important emerging players. Selected Key Players: ASE Group AT&S Austria Technologie & Systemtechnik AG Fujitsu Ltd. IBIDEN Co., Ltd. Kinsus Interconnect Technology Corp. Korea Circuit Co., Ltd. KYOCERA Corporation LG Innotek Co., Ltd. Nan Ya PCB Co., Ltd. (Nan Ya Plastics Corporation) Shenzhen Fastprint Circuit Tech Shinko Electric Industries Co., Ltd. Siliconware Precision Industries Co., Ltd. STATS ChipPAC Pte. Ltd. TTM Technologies Inc. Unimicron Corporation Zhen Ding Technology Holding Ltd. Zhuhai ACCESS Semiconductor (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.) ...

9/30/2022

North America advanced IC substrates market is projected to grow by 6.6% annually in the forecast period and reach $1,919.2 million by 2031, driven by the rising adoption of advanced substrates in manufacturing of electronics, the increasing prevalence and functionality of consumer electronic products such as smart devices and smart wearables, and the increasing penetration of advanced technologies such as 5G and IoT connected devices. Highlighted with 23 tables and 46 figures, this 103-page report “North America Advanced IC Substrates Market 2021-2031 by Packaging Type (FC BGA, FC CSP, Others), Material Type (Rigid, Flex, Ceramic), Manufacturing Method (SP, AP, MSAP), Bonding Technology (Wire Bonding, FC Bonding, TAB), Application (Mobile and Consumer Electronics, Automotive and Transportation, IT and Telecom, Others), and Country: Trend Forecast and Growth Opportunity.” is based on a comprehensive research of the entire North America advanced IC substrates market and all its sub-segments through extensively detailed classifications. Profound analysis and assessment are generated from premium primary and secondary information sources with inputs derived from industry professionals across the value chain. The report is based on studies on 2019-2021 and provides forecast from 2022 till 2031 with 2021 as the base year. (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.) In-depth qualitative analyses include identification and investigation of the following aspects: • Market Structure • Growth Drivers • Restraints and Challenges • Emerging Product Trends & Market Opportunities • Porter’s Fiver Forces The trend and outlook of North America market is forecast in optimistic, balanced, and conservative view by taking into account of COVID-19 and Russia-Ukraine conflict. The balanced (most likely) projection is used to quantify North America advanced IC substrates market in every aspect of the classification from perspectives of Packaging Type, Material Type, Manufacturing Method, Bonding Technology, Application, and Country. Based on Packaging Type, the North America market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section. • FC BGA • FC CSP • Other Packaging Types Based on Material Type, the North America market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section. • Rigid Integrated Circuit Substrate • Flex Integrated Circuit Substrate • Ceramic Integrated Circuit Substrate By Manufacturing Method, the North America market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section. • Subtraction Process (SP) • Addition Process (AP) • Modified Semi-additive Process (MSAP) By Bonding Technology, the North America market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section. • Wire Bonding • FC Bonding • Tape Automated Bonding (TAB) By Application, the North America market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section. • Mobile and Consumer Electronics • Automotive and Transportation • IT and Telecom • Other Applications Geographically, the following national/local markets are fully investigated: • U.S. • Canada • Mexico For each key country, detailed analysis and data for annual revenue ($ mn) are available for 2021-2031. The breakdown of national markets by Packaging Type, Material Type and Application over the forecast years are also included. The report also covers current competitive scenario and the predicted trend; and profiles key vendors including market leaders and important emerging players. Selected Key Players: ASE Group AT&S Austria Technologie & Systemtechnik AG Fujitsu Ltd. IBIDEN Co., Ltd. Kinsus Interconnect Technology Corp. Korea Circuit Co., Ltd. KYOCERA Corporation LG Innotek Co., Ltd. Nan Ya PCB Co., Ltd. (Nan Ya Plastics Corporation) Shenzhen Fastprint Circuit Tech Shinko Electric Industries Co., Ltd. Siliconware Precision Industries Co., Ltd. STATS ChipPAC Pte. Ltd. TTM Technologies Inc. Unimicron Corporation Zhen Ding Technology Holding Ltd. Zhuhai ACCESS Semiconductor (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.) ...

9/30/2022

Global advanced IC substrates market will reach $16,953.8 million by 2031, growing by 7.1% annually over 2021-2031, driven by the rising adoption of advanced substrates in manufacturing of electronics, the increasing prevalence and functionality of consumer electronic products such as smart devices and smart wearables, and the increasing penetration of advanced technologies such as 5G and IoT connected devices. Highlighted with 82 tables and 82 figures, this 165-page report “Global Advanced IC Substrates Market 2021-2031 by Packaging Type (FC BGA, FC CSP, Others), Material Type (Rigid, Flex, Ceramic), Manufacturing Method (SP, AP, MSAP), Bonding Technology (Wire Bonding, FC Bonding, TAB), Application (Mobile and Consumer Electronics, Automotive and Transportation, IT and Telecom, Others), and Region: Trend Forecast and Growth Opportunity.” is based on a comprehensive research of the entire global advanced IC substrates market and all its sub-segments through extensively detailed classifications. Profound analysis and assessment are generated from premium primary and secondary information sources with inputs derived from industry professionals across the value chain. The report is based on studies on 2019-2021 and provides forecast from 2022 till 2031 with 2021 as the base year. (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.) In-depth qualitative analyses include identification and investigation of the following aspects: • Market Structure • Growth Drivers • Restraints and Challenges • Emerging Product Trends & Market Opportunities • Porter’s Fiver Forces The trend and outlook of global market is forecast in optimistic, balanced, and conservative view by taking into account of COVID-19 and Russia-Ukraine conflict. The balanced (most likely) projection is used to quantify global advanced IC substrates market in every aspect of the classification from perspectives of Packaging Type, Material Type, Manufacturing Method, Bonding Technology, Application, and Region. Based on Packaging Type, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section. • FC BGA • FC CSP • Other Packaging Types Based on Material Type, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section. • Rigid Integrated Circuit Substrate • Flex Integrated Circuit Substrate • Ceramic Integrated Circuit Substrate By Manufacturing Method, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section. • Subtraction Process (SP) • Addition Process (AP) • Modified Semi-additive Process (MSAP) By Bonding Technology, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section. • Wire Bonding • FC Bonding • Tape Automated Bonding (TAB) By Application, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section. • Mobile and Consumer Electronics • Automotive and Transportation • IT and Telecom • Other Applications Geographically, the following regions together with the listed national/local markets are fully investigated: • North America (U.S., Canada, and Mexico) • Europe (Germany, UK, France, Spain, Italy, Netherlands, Rest of Europe; Rest of Europe is further segmented into Russia, Switzerland, Poland, Sweden, Belgium, Austria, Ireland, Norway, Denmark, and Finland) • APAC (Japan, China, South Korea, Australia, Taiwan, and Rest of APAC; Rest of APAC is further segmented into Malaysia, Singapore, Indonesia, Thailand, New Zealand, Vietnam, India, and Philippines) • South America (Brazil, Chile, Argentina, Rest of South America) • MEA (UAE，Saudi Arabia， South Africa and Rest of MEA) For each aforementioned region and country, detailed analysis and data for annual revenue ($ mn) are available for 2021-2031. The breakdown of all regional markets by country and split of each national market by Packaging Type, Material Type and Application over the forecast years are also included. The report also covers current competitive scenario and the predicted trend; and profiles key vendors including market leaders and important emerging players. Selected Key Players: ASE Group AT&S Austria Technologie & Systemtechnik AG Fujitsu Ltd. IBIDEN Co., Ltd. Kinsus Interconnect Technology Corp. Korea Circuit Co., Ltd. KYOCERA Corporation LG Innotek Co., Ltd. Nan Ya PCB Co., Ltd. (Nan Ya Plastics Corporation) Shenzhen Fastprint Circuit Tech Shinko Electric Industries Co., Ltd. Siliconware Precision Industries Co., Ltd. STATS ChipPAC Pte. Ltd. TTM Technologies Inc. Unimicron Corporation Zhen Ding Technology Holding Ltd. Zhuhai ACCESS Semiconductor (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.) ...

2022-10-04

Asia Pacific substrate-like PCB (SLP) market will grow by 15.6% annually with a total addressable market cap of $ 25,000.1 million over 2022-2031, driven by SLP’s ability to enable faster transmission while simultaneously giving the manufacturers more freedom to design their product, increasing R&D activities for technological advancements, the rising prevalence of smart consumer electronics such as smartphones and wearable devices, and the growing demand for effective connectivity solutions and the growing trend of miniaturization. Highlighted with 26 tables and 36 figures, this 88-page report “Asia Pacific Substrate-Like PCB (SLP) Market 2021-2031 by Inspection Technology (AOI, DI, AOS), Line/Space (25/25 and 30/30 μm, Less than 25/25 μm), Application (Consumer Electronics, Automotive, Medical, Industrial, Computing and Communications, Others), and Country: Trend Forecast and Growth Opportunity” is based on a comprehensive research of the entire Asia Pacific substrate-like PCB (SLP) market and all its sub-segments through extensively detailed classifications. Profound analysis and assessment are generated from premium primary and secondary information sources with inputs derived from industry professionals across the value chain. The report is based on studies on 2019-2021 and provides forecast from 2022 till 2031 with 2021 as the base year. (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.) In-depth qualitative analyses include identification and investigation of the following aspects: • Market Structure • Growth Drivers • Restraints and Challenges • Emerging Product Trends & Market Opportunities • Porter’s Fiver Forces The trend and outlook of Asia Pacific market is forecast in optimistic, balanced, and conservative view by taking into account of COVID-19 and Russia-Ukraine conflict. The balanced (most likely) projection is used to quantify Asia Pacific substrate-like PCB (SLP) market in every aspect of the classification from perspectives of Inspection Technology, Line/Space, Application, and Country. Based on Inspection Technology, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section. • Automated Optical Inspection (AOI) • Direct Imaging (DI) • Automated Optical Shaping (AOS) Based on Line/Space, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section. • 25/25 and 30/30 μm • Less than 25/25 μm By Application, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section. • Consumer Electronics • Automotive Industry • Medical Industry • Industrial Use • Computing and Communications • Other Applications Geographically, the following national/local markets are fully investigated: • Japan • China • South Korea • Australia • India • Rest of APAC (further segmented into Malaysia, Singapore, Indonesia, Thailand, New Zealand, Vietnam, Taiwan, and Philippines) For each key country, detailed analysis and data for annual revenue ($ mn) are available for 2021-2031. The breakdown of national markets by Inspection Technology, Line/Space and Application over the forecast years are also included. The report also covers current competitive scenario and the predicted trend; and profiles key vendors including market leaders and important emerging players. Selected Key Players: Austria Technologie & Systemtechnik Aktiengesellschaft (AT&S) China Circuit Technology Corporation Compaq Manufacturing Co., Ltd. Daeduck Electronics Co., Ltd. HannStar Board Corporation Ibiden Co., Ltd. Kinsus Interconnect Technology Corp Korea Circuit Co., Ltd. Samsung Electro-Mechanics Co., Ltd. Shenzhen Fastprint Circuit Tech Co., Ltd. Symtek Automation Asia Co., Ltd. TTM Technologies, Inc. Unimicron Technology Corp. Zhen Ding Tech. Group Technology Holding Limited (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.) ...

9/30/2022

Europe substrate-like PCB (SLP) market was valued at $ 94.5 million in 2021 and will grow by 11.4% annually over 2021-2031, driven by SLP’s ability to enable faster transmission while simultaneously giving the manufacturers more freedom to design their product, increasing R&D activities for technological advancements, the rising prevalence of smart consumer electronics such as smartphones and wearable devices, and the growing demand for effective connectivity solutions and the growing trend of miniaturization. Highlighted with 29 tables and 37 figures, this 89-page report “Europe Substrate-Like PCB (SLP) Market 2021-2031 by Inspection Technology (AOI, DI, AOS), Line/Space (25/25 and 30/30 μm, Less than 25/25 μm), Application (Consumer Electronics, Automotive, Medical, Industrial, Computing and Communications, Others), and Country: Trend Forecast and Growth Opportunity” is based on a comprehensive research of the entire Europe substrate-like PCB (SLP) market and all its sub-segments through extensively detailed classifications. Profound analysis and assessment are generated from premium primary and secondary information sources with inputs derived from industry professionals across the value chain. The report is based on studies on 2019-2021 and provides forecast from 2022 till 2031 with 2021 as the base year. (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.) In-depth qualitative analyses include identification and investigation of the following aspects: • Market Structure • Growth Drivers • Restraints and Challenges • Emerging Product Trends & Market Opportunities • Porter’s Fiver Forces The trend and outlook of Europe market is forecast in optimistic, balanced, and conservative view by taking into account of COVID-19 and Russia-Ukraine conflict. The balanced (most likely) projection is used to quantify Europe substrate-like PCB (SLP) market in every aspect of the classification from perspectives of Inspection Technology, Line/Space, Application, and Country. Based on Inspection Technology, the Europe market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section. • Automated Optical Inspection (AOI) • Direct Imaging (DI) • Automated Optical Shaping (AOS) Based on Line/Space, the Europe market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section. • 25/25 and 30/30 μm • Less than 25/25 μm By Application, the Europe market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section. • Consumer Electronics • Automotive Industry • Medical Industry • Industrial Use • Computing and Communications • Other Applications Geographically, the following national/local markets are fully investigated: • Germany • UK • France • Spain • Italy • Netherlands • Rest of Europe (further segmented into Russia, Switzerland, Poland, Sweden, Belgium, Austria, Ireland, Norway, Denmark, and Finland) For each key country, detailed analysis and data for annual revenue ($ mn) are available for 2021-2031. The breakdown of national markets by Inspection Technology, Line/Space and Application over the forecast years are also included. The report also covers current competitive scenario and the predicted trend; and profiles key vendors including market leaders and important emerging players. Selected Key Players: Austria Technologie & Systemtechnik Aktiengesellschaft (AT&S) China Circuit Technology Corporation Compaq Manufacturing Co., Ltd. Daeduck Electronics Co., Ltd. HannStar Board Corporation Ibiden Co., Ltd. Kinsus Interconnect Technology Corp Korea Circuit Co., Ltd. Samsung Electro-Mechanics Co., Ltd. Shenzhen Fastprint Circuit Tech Co., Ltd. Symtek Automation Asia Co., Ltd. TTM Technologies, Inc. Unimicron Technology Corp. Zhen Ding Tech. Group Technology Holding Limited (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.) ...

9/30/2022

North America substrate-like PCB (SLP) market is projected to grow by 14.8% annually in the forecast period and reach $874.8 million by 2031, driven by SLP’s ability to enable faster transmission while simultaneously giving the manufacturers more freedom to design their product, increasing R&D activities for technological advancements, the rising prevalence of smart consumer electronics such as smartphones and wearable devices, and the growing demand for effective connectivity solutions and the growing trend of miniaturization. Highlighted with 19 tables and 33 figures, this 82-page report “North America Substrate-Like PCB (SLP) Market 2021-2031 by Inspection Technology (AOI, DI, AOS), Line/Space (25/25 and 30/30 μm, Less than 25/25 μm), Application (Consumer Electronics, Automotive, Medical, Industrial, Computing and Communications, Others), and Country: Trend Forecast and Growth Opportunity” is based on a comprehensive research of the entire North America substrate-like PCB (SLP) market and all its sub-segments through extensively detailed classifications. Profound analysis and assessment are generated from premium primary and secondary information sources with inputs derived from industry professionals across the value chain. The report is based on studies on 2019-2021 and provides forecast from 2022 till 2031 with 2021 as the base year. (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.) In-depth qualitative analyses include identification and investigation of the following aspects: • Market Structure • Growth Drivers • Restraints and Challenges • Emerging Product Trends & Market Opportunities • Porter’s Fiver Forces The trend and outlook of North America market is forecast in optimistic, balanced, and conservative view by taking into account of COVID-19 and Russia-Ukraine conflict. The balanced (most likely) projection is used to quantify North America substrate-like PCB (SLP) market in every aspect of the classification from perspectives of Inspection Technology, Line/Space, Application, and Country. Based on Inspection Technology, the North America market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section. • Automated Optical Inspection (AOI) • Direct Imaging (DI) • Automated Optical Shaping (AOS) Based on Line/Space, the North America market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section. • 25/25 and 30/30 μm • Less than 25/25 μm By Application, the North America market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section. • Consumer Electronics • Automotive Industry • Medical Industry • Industrial Use • Computing and Communications • Other Applications Geographically, the following national/local markets are fully investigated: • U.S. • Canada • Mexico For each key country, detailed analysis and data for annual revenue ($ mn) are available for 2021-2031. The breakdown of national markets by Inspection Technology, Line/Space and Application over the forecast years are also included. The report also covers current competitive scenario and the predicted trend; and profiles key vendors including market leaders and important emerging players. Selected Key Players: Austria Technologie & Systemtechnik Aktiengesellschaft (AT&S) China Circuit Technology Corporation Compaq Manufacturing Co., Ltd. Daeduck Electronics Co., Ltd. HannStar Board Corporation Ibiden Co., Ltd. Kinsus Interconnect Technology Corp Korea Circuit Co., Ltd. Samsung Electro-Mechanics Co., Ltd. Shenzhen Fastprint Circuit Tech Co., Ltd. Symtek Automation Asia Co., Ltd. TTM Technologies, Inc. Unimicron Technology Corp. Zhen Ding Tech. Group Technology Holding Limited (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.) ...

9/30/2022

Global substrate-like PCB (SLP) market will reach $5,983.6 million by 2031, growing by 14.9% annually over 2021-2031, driven by SLP’s ability to enable faster transmission while simultaneously giving the manufacturers more freedom to design their product, increasing R&D activities for technological advancements, the rising prevalence of smart consumer electronics such as smartphones and wearable devices, and the growing demand for effective connectivity solutions and the growing trend of miniaturization. Highlighted with 78 tables and 69 figures, this 144-page report “Global Substrate-Like PCB (SLP) Market 2021-2031 by Inspection Technology (AOI, DI, AOS), Line/Space (25/25 and 30/30 μm, Less than 25/25 μm), Application (Consumer Electronics, Automotive, Medical, Industrial, Computing and Communications, Others), and Region: Trend Forecast and Growth Opportunity” is based on a comprehensive research of the entire global substrate-like PCB (SLP) market and all its sub-segments through extensively detailed classifications. Profound analysis and assessment are generated from premium primary and secondary information sources with inputs derived from industry professionals across the value chain. The report is based on studies on 2019-2021 and provides forecast from 2022 till 2031 with 2021 as the base year. (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.) In-depth qualitative analyses include identification and investigation of the following aspects: • Market Structure • Growth Drivers • Restraints and Challenges • Emerging Product Trends & Market Opportunities • Porter’s Fiver Forces The trend and outlook of global market is forecast in optimistic, balanced, and conservative view by taking into account of COVID-19 and Russia-Ukraine conflict. The balanced (most likely) projection is used to quantify global substrate-like PCB (SLP) market in every aspect of the classification from perspectives of Inspection Technology, Line/Space, Application, and Region. Based on Inspection Technology, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section. • Automated Optical Inspection (AOI) • Direct Imaging (DI) • Automated Optical Shaping (AOS) Based on Line/Space, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section. • 25/25 and 30/30 μm • Less than 25/25 μm By Application, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section. • Consumer Electronics • Automotive Industry • Medical Industry • Industrial Use • Computing and Communications • Other Applications Geographically, the following regions together with the listed national/local markets are fully investigated: • North America (U.S., Canada, and Mexico) • Europe (Germany, UK, France, Spain, Italy, Netherlands, Rest of Europe; Rest of Europe is further segmented into Russia, Switzerland, Poland, Sweden, Belgium, Austria, Ireland, Norway, Denmark, and Finland) • APAC (Japan, China, South Korea, Australia, India, and Rest of APAC; Rest of APAC is further segmented into Malaysia, Singapore, Indonesia, Thailand, New Zealand, Vietnam, Taiwan, and Philippines) • South America (Brazil, Chile, Argentina, Rest of South America) • MEA (UAE，Saudi Arabia， South Africa and Rest of MEA) For each aforementioned region and country, detailed analysis and data for annual revenue ($ mn) are available for 2021-2031. The breakdown of all regional markets by country and split of each national market by Inspection Technology, Line/Space and Application over the forecast years are also included. The report also covers current competitive scenario and the predicted trend; and profiles key vendors including market leaders and important emerging players. Selected Key Players: Austria Technologie & Systemtechnik Aktiengesellschaft (AT&S) China Circuit Technology Corporation Compaq Manufacturing Co., Ltd. Daeduck Electronics Co., Ltd. HannStar Board Corporation Ibiden Co., Ltd. Kinsus Interconnect Technology Corp Korea Circuit Co., Ltd. Samsung Electro-Mechanics Co., Ltd. Shenzhen Fastprint Circuit Tech Co., Ltd. Symtek Automation Asia Co., Ltd. TTM Technologies, Inc. Unimicron Technology Corp. Zhen Ding Tech. Group Technology Holding Limited (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.) ...

2022-09-30

Global encoder market will reach $6.31 billion by 2033, growing by 9.3% annually over 2023-2033. The growth is driven by the increased need for high-level automation across various industries, the surging demand for automobile and consumer electronics, and technological advancements. Highlighted with 82 tables and 82 figures, this 175-page report “Global Encoder Market 2023-2033 by Encoder Type (Rotary, Linear), Signal Type (Absolute, Incremental), Technology (Optical, Magnetic, Photoelectric, Inductive), Application (Automotive, Electronics, Industrial, Healthcare), and Region: Trend Forecast and Growth Opportunity” is based on comprehensive research of the entire global encoder market and all its sub-segments through extensively detailed classifications. Profound analysis and assessment are generated from premium primary and secondary information sources with inputs derived from industry professionals across the value chain. The report is based on studies on 2021-2023 and provides forecast from 2024 till 2033 with 2023 as the base year. (Please note: The report will be updated before delivery so that the latest historical year is the base year, and the forecast covers at least 5 years over the base year.) In-depth qualitative analyses include identification and investigation of the following aspects: • Market Structure • Growth Drivers • Restraints and Challenges • Emerging Product Trends & Market Opportunities • Porter’s Fiver Forces The trend and outlook of global market is forecast in optimistic, balanced, and conservative view by taking into account of COVID-19 and Russia-Ukraine conflict. The balanced (most likely) projection is used to quantify global encoder market in every aspect of the classification from perspectives of Encoder Type, Signal Type, Technology, Application, and Region. Based on Encoder Type, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2023-2033 included in each section. • Rotary Encoders • Linear Encoders Based on Signal Type, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2023-2033 included in each section. • Absolute Encoders • Incremental Encoders By Technology, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2023-2033 included in each section. • Optical Encoders • Magnetic Encoders • Photoelectric Encoders • Inductive Encoders • Other Technologies By Application, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2023-2033 included in each section. • Automotive • Consumer Electronics • Textile • Printing Machinery • Industrial • Healthcare • Food & Beverage • Power • Aerospace • Other Applications Geographically, the following regions together with the listed national/local markets are fully investigated: • North America (U.S., Canada, and Mexico) • Europe (Germany, UK, France, Spain, Italy, Russia, Rest of Europe; Rest of Europe is further segmented into Netherlands, Switzerland, Poland, Sweden, Belgium, Austria, Ireland, Norway, Denmark, and Finland) • APAC (Japan, China, South Korea, Australia, India, and Rest of APAC; Rest of APAC is further segmented into Malaysia, Singapore, Indonesia, Thailand, New Zealand, Vietnam, Taiwan, and Philippines) • South America (Brazil, Chile, Argentina, Rest of South America) • MEA (UAE, Saudi Arabia, South Africa, and Rest of MEA) For each region and country, detailed analysis and annual revenue ($ mn) are available for 2023-2033. The breakdown of all regional markets by country and the breakdown of each national market by Encoder Type, Technology, and Application over the forecast years are also included. The report also covers the current competitive scenario and the predicted trend; and profiles key vendors including market leaders and important emerging players. Selected Key Players: Balluff Inc. Baumer Group Dynapar Corporation (Fortive Corporation) Elap Srl Faulhaber Group Fraba B.V. (Posital Fraba Inc.) Gurley Precision Instruments Heidenhain GmbH Hengstler GmbH Honeywell International IFM Electronic GmbH Kubler Group Maxon Motor AG Mitutoyo Corporation Omron Corporation Panasonic Corporation Pepperl+Fuchs International Pilz GmbH & Co. KG Renishaw PLC Rockwell Automation Inc. Schneider Electric Sensata Technologies, Inc. Sick AG Siko GmbH Tamagawa Seiki Co. TE Connectivity (Please note: The report will be updated before delivery so that the latest historical year is the base year, and the forecast covers at least 5 years over the base year.) Selected Key Players: Balluff Inc. Baumer Group Dynapar Corporation (Fortive Corporation) Elap Srl Faulhaber Group Fraba B.V. (Posital Fraba Inc.) Gurley Precision Instruments Heidenhain GmbH Hengstler GmbH Honeywell International IFM Electronic GmbH Kubler Group Maxon Motor AG Mitutoyo Corporation Omron Corporation Panasonic Corporation Pepperl+Fuchs International Pilz GmbH & Co. KG Renishaw PLC Rockwell Automation Inc. Schneider Electric Sensata Technologies, Inc. Sick AG Siko GmbH Tamagawa Seiki Co. TE Connectivity (Please note: The report will be updated before delivery so that the latest historical year is the base year, and the forecast covers at least 5 years over the base year.) ...

2024-03-08

Asia Pacific consumer internet of things (CIoT) market will grow by 18.4% annually with a total addressable market cap of $706,479.6 million over 2022-2031, driven by the increasing in efficiency of CIoT products and services, rising internet penetration, increasing disposable income, surging consumer preference for convenience and better lifestyle, increasing adoption of smart and multimedia devices, and the growing government regulations for the security of IoT devices. Highlighted with 31 tables and 46 figures, this 101-page report “Asia Pacific Consumer Internet of Things (CIoT) Market 2021-2031 by Offering (Hardware, Solutions, Services), Connectivity (Wired, Wireless), Application (Home Automation, Consumer Wearables, Consumer Electronics, Healthcare, Automotive), and Country: Trend Forecast and Growth Opportunity” is based on a comprehensive research of the entire Asia Pacific consumer internet of things (CIoT) market and all its sub-segments through extensively detailed classifications. Profound analysis and assessment are generated from premium primary and secondary information sources with inputs derived from industry professionals across the value chain. The report is based on studies on 2018-2021 and provides forecast from 2022 till 2031 with 2021 as the base year. (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.) In-depth qualitative analyses include identification and investigation of the following aspects: • Market Structure • Growth Drivers • Restraints and Challenges • Emerging Product Trends & Market Opportunities • Porter’s Fiver Forces The trend and outlook of Asia Pacific market is forecast in optimistic, balanced, and conservative view by taking into account of COVID-19 and Russia-Ukraine conflict. The balanced (most likely) projection is used to quantify Asia Pacific consumer internet of things (CIoT) market in every aspect of the classification from perspectives of Offering, Connectivity, Application, and Country. Based on Offering, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section. • Hardware o Network Infrastructure (Server, Storage, Gateway, Ethernet Switch and Routing) o Node Components (Processors, Sensors, Connectivity IC, Memory Devices, Logic Devices) • Solutions o Software o Platform • Services o Professional Services o Managed Services Based on Connectivity, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section. • Wired CIoT • Wireless CioT By Application, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section. • Home Automation • Consumer Wearables • Consumer Electronics • Healthcare • Automotive Geographically, the following national/local markets are fully investigated: • Japan • China • South Korea • Australia • India • Rest of APAC (further segmented into Malaysia, Singapore, Indonesia, Thailand, New Zealand, Vietnam, Taiwan, and Philippines) For each key country, detailed analysis and data for annual revenue ($ mn) are available for 2021-2031. The breakdown of national markets by Offering, Connectivity and Application over the forecast years are also included. The report also covers current competitive scenario and the predicted trend; and profiles key vendors including market leaders and important emerging players. Selected Key Players: Amazon.com Inc. Apple Inc. Cisco Systems, Inc. General Electric (GE) Co. Google Hewlett Packard Enterprise Development LP Honeywell International Inc. Intel Corporation International Business Machines Corporation (IBM) Microsoft Corporation NXP Semiconductors N.V. Qualcomm Technologies Inc. STMicroelectronics TE Connectivity Ltd. Texas Instruments Incorporated (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.) ...

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