Asia Pacific Industrial Sensors Market 2022-2032 by Sensor Type (Level, Pressure, Position, Gas, Image, Magnetic, Others), Category (Contact, Non-contact), Technology (MEMS, CMOS, Optical, NEMS), Indu...

Asia Pacific industrial sensors will grow by 10.7% annually with a total addressable market cap of $129,152.1 million over 2023-2032, driven by the rising adoption of Industrial 4.0 and IIoT in manufacturing, a surging demand for smart sensor-enabled wearable devices, the increasing adoption of indu...

4/30/2023 | Computers, Electrics & Communications

Europe Industrial Sensors Market 2022-2032 by Sensor Type (Level, Pressure, Position, Gas, Image, Magnetic, Others), Category (Contact, Non-contact), Technology (MEMS, CMOS, Optical, NEMS), Industry V...

Europe industrial sensors market was valued at $5,303.2 million in 2022 and will grow by 9.3% annually over 2022-2032, driven by the rising adoption of Industrial 4.0 and IIoT in manufacturing, a surging demand for smart sensor-enabled wearable devices, the increasing adoption of industrial robots, ...

4/30/2023 | Computers, Electrics & Communications

North America Industrial Sensors Market 2022-2032 by Sensor Type (Level, Pressure, Position, Gas, Image, Magnetic, Others), Category (Contact, Non-contact), Technology (MEMS, CMOS, Optical, NEMS), Ind...

North America industrial sensors market is projected to grow by 8.6% annually in the forecast period and reach $15,133.5 million by 2032, driven by the rising adoption of Industrial 4.0 and IIoT in manufacturing, a surging demand for smart sensor-enabled wearable devices, the increasing adoption of ...

4/30/2023 | Computers, Electrics & Communications

Global Industrial Sensors Market 2022-2032 by Sensor Type (Level, Pressure, Position, Gas, Image, Magnetic, Others), Category (Contact, Non-contact), Technology (MEMS, CMOS, Optical, NEMS), Industry V...

Global industrial sensors market will reach $54,673.1 million by 2032, growing by 9.5% annually over 2022-2032, driven by the rising adoption of Industrial 4.0 and IIoT in manufacturing, a surging demand for smart sensor-enabled wearable devices, the increasing adoption of industrial robots, and gro...

2023-04-30 | Computers, Electrics & Communications

Asia Pacific Advanced IC Substrates Market 2022-2031 by Packaging Type (FC BGA, FC CSP, Others), Material Type (Rigid, Flex, Ceramic), Manufacturing Method (SP, AP, MSAP), Bonding Technology (Wire Bon...

Asia Pacific advanced IC substrates market will grow by 7.6% annually with a total addressable market cap of $92,888.8 million over 2023-2031, driven by the rising adoption of advanced substrates in manufacturing of electronics, the increasing prevalence and functionality of consumer electronic prod...

4/30/2023 | Computers, Electrics & Communications

Europe Advanced IC Substrates Market 2022-2031 by Packaging Type (FC BGA, FC CSP, Others), Material Type (Rigid, Flex, Ceramic), Manufacturing Method (SP, AP, MSAP), Bonding Technology (Wire Bonding, ...

Europe advanced IC substrates market was valued at $562.7 million in 2022 and will grow by 5.4% annually over 2022-2031, driven by the rising adoption of advanced substrates in manufacturing of electronics, the increasing prevalence and functionality of consumer electronic products sch as smart devi...

4/30/2023 | Computers, Electrics & Communications

North America Advanced IC Substrates Market 2022-2031 by Packaging Type (FC BGA, FC CSP, Others), Material Type (Rigid, Flex, Ceramic), Manufacturing Method (SP, AP, MSAP), Bonding Technology (Wire Bo...

North America advanced IC substrates market is projected to grow by 6.8% annually in the forecast period and reach $1,919.2 million by 2031, driven by the rising adoption of advanced substrates in manufacturing of electronics, the increasing prevalence and functionality of consumer electronic produc...

4/30/2023 | Computers, Electrics & Communications

Global Advanced IC Substrates Market 2022-2031 by Packaging Type (FC BGA, FC CSP, Others), Material Type (Rigid, Flex, Ceramic), Manufacturing Method (SP, AP, MSAP), Bonding Technology (Wire Bonding, ...

Global advanced IC substrates market will reach $16,953.8 million by 2031, growing by 7.3% annually over 2022-2031, driven by the rising adoption of advanced substrates in manufacturing of electronics, the increasing prevalence and functionality of consumer electronic products such as smart devices ...

2023-04-30 | Computers, Electrics & Communications

Asia Pacific Smart Card Market 2022-2032 by Component (Hardware, Software, Services), Interface (Contact-based, Contactless, Dual, Hybrid), Card Type (Memory-based, MPU Microprocessor), Function (Tran...

Asia Pacific smart card market will grow by 7.8% annually with a total addressable market cap of $85,100.6 million over 2023-2032, driven by the rising popularity and adoption of these smart cards in various sectors, the high penetration of smart cards in access control and personal identification a...

4/30/2023 | Computers, Electrics & Communications

Europe Smart Card Market 2022-2032 by Component (Hardware, Software, Services), Interface (Contact-based, Contactless, Dual, Hybrid), Card Type (Memory-based, MPU Microprocessor), Function (Transactio...

Europe smart card market was valued at $3,724.5 million in 2022 and will grow by 6.0% annually over 2022-2032, driven by the rising popularity and adoption of these smart cards in various sectors, the high penetration of smart cards in access control and personal identification applications, expansi...

4/30/2023 | Computers, Electrics & Communications

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Asia Pacific industrial sensors will grow by 10.7% annually with a total addressable market cap of $129,152.1 million over 2023-2032, driven by the rising adoption of Industrial 4.0 and IIoT in manufacturing, a surging demand for smart sensor-enabled wearable devices, the increasing adoption of industrial robots, and growing automation in manufacturing and various other industries. Highlighted with 33 tables and 73 figures, this 148-page report “Asia Pacific Industrial Sensors Market 2022-2032 by Sensor Type (Level, Pressure, Position, Gas, Image, Magnetic, Others), Category (Contact, Non-contact), Technology (MEMS, CMOS, Optical, NEMS), Industry Vertical (Oil & Gas, Pharmaceuticals, Chemicals, Manufacturing, Automotive, Others), and Country: Trend Forecast and Growth Opportunity” is based on a comprehensive research of the entire Asia Pacific industrial sensors market and all its sub-segments through extensively detailed classifications. Profound analysis and assessment are generated from premium primary and secondary information sources with inputs derived from industry professionals across the value chain. The report is based on studies on 2020-2022 and provides forecast from 2023 till 2032 with 2022 as the base year. (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.) In-depth qualitative analyses include identification and investigation of the following aspects: • Market Structure • Growth Drivers • Restraints and Challenges • Emerging Product Trends & Market Opportunities • Porter’s Fiver Forces The trend and outlook of Asia Pacific market is forecast in optimistic, balanced, and conservative view by taking into account of COVID-19 and Russia-Ukraine conflict. The balanced (most likely) projection is used to quantify Asia Pacific industrial sensors market in every aspect of the classification from perspectives of Sensor Type, Category, Technology, Industry Vertical, and Country. Based on Sensor Type, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn), average selling price (USD/unit), and volume (thousand units) for 2022-2032 included in each section. • Level Sensors • Pressure Sensors • Position Sensors • Gas Sensors • Image Sensor • Magnetic Sensor • Electromagnetic Sensor • Temperature Sensor • Flow Sensors • Force Sensors • Other Sensor Types Based on Category, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2032 included in each section. • Contact Sensors • Non-contact Sensors By Technology, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2032 included in each section. • Micro-Electro-Mechanical Systems (MEMS) o MEMS Gyroscopes o MEMS Pressure Sensors (Absolute Pressure Sensor, Vacuum Pressure Sensor, Sealed Pressure Sensor, Gauge Pressure Sensor and Differential Pressure Sensor) o MEMS Magnetic Field Sensors • Complementary Metal Oxide Semiconductor (CMOS) • Optical Sensing • Nanoelectromechanical Systems (NEMS) • Other Technologies By Industry Vertical, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2032 included in each section. • Oil & Gas • Pharmaceuticals • Chemicals • Manufacturing • Automotive • Energy & Power • Mining • Other Industry Verticals Geographically, the following national/local markets are fully investigated: • Japan • China • South Korea • Australia • India • Rest of APAC (further segmented into Malaysia, Singapore, Indonesia, Thailand, New Zealand, Vietnam, Taiwan, and Philippines) For each key country, detailed analysis and data for annual revenue ($ mn) are available for 2022-2032. The breakdown of national markets by Sensor Type, Technology and Industry Vertical over the forecast years are also included. The report also covers the current competitive scenario and the predicted trend; and profiles key vendors including market leaders and important emerging players. Selected Key Players: ABB Ltd. Amphenol Corporation Ams AG Bosch Sensortec GmbH Crocus Technology, Inc. Dwyer Instruments, Inc. Endress+Hauser Management AG Figaro Engineering Inc. Honeywell International Inc. Infineon Technologies AG Microchip Technology Inc. Nxp Semiconductors N.V. Omega Engineering Inc. Panasonic Corporation Renesas Electronics Corporation (Renesas) Rockwell Automation Inc. Sensirion AG Siemens AG STMicroelectronics NV TE Connectivity Ltd. Teledyne Technologies Inc. Texas Instruments Inc. (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.) ...

4/30/2023

Europe industrial sensors market was valued at $5,303.2 million in 2022 and will grow by 9.3% annually over 2022-2032, driven by the rising adoption of Industrial 4.0 and IIoT in manufacturing, a surging demand for smart sensor-enabled wearable devices, the increasing adoption of industrial robots, and growing automation in manufacturing and various other industries. Highlighted with 36 tables and 74 figures, this 150-page report “Europe Industrial Sensors Market 2022-2032 by Sensor Type (Level, Pressure, Position, Gas, Image, Magnetic, Others), Category (Contact, Non-contact), Technology (MEMS, CMOS, Optical, NEMS), Industry Vertical (Oil & Gas, Pharmaceuticals, Chemicals, Manufacturing, Automotive, Others), and Country: Trend Forecast and Growth Opportunity” is based on a comprehensive research of the entire Europe industrial sensors market and all its sub-segments through extensively detailed classifications. Profound analysis and assessment are generated from premium primary and secondary information sources with inputs derived from industry professionals across the value chain. The report is based on studies on 2020-2022 and provides forecast from 2023 till 2032 with 2022 as the base year. (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.) In-depth qualitative analyses include identification and investigation of the following aspects: • Market Structure • Growth Drivers • Restraints and Challenges • Emerging Product Trends & Market Opportunities • Porter’s Fiver Forces The trend and outlook of Europe market is forecast in optimistic, balanced, and conservative view by taking into account of COVID-19 and Russia-Ukraine conflict. The balanced (most likely) projection is used to quantify Europe industrial sensors market in every aspect of the classification from perspectives of Sensor Type, Category, Technology, Industry Vertical, and Country. Based on Sensor Type, the Europe market is segmented into the following sub-markets with annual revenue ($ mn), average selling price (USD/unit), and volume (thousand units) for 2022-2032 included in each section. • Level Sensors • Pressure Sensors • Position Sensors • Gas Sensors • Image Sensor • Magnetic Sensor • Electromagnetic Sensor • Temperature Sensor • Flow Sensors • Force Sensors • Other Sensor Types Based on Category, the Europe market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2032 included in each section. • Contact Sensors • Non-contact Sensors By Technology, the Europe market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2032 included in each section. • Micro-Electro-Mechanical Systems (MEMS) o MEMS Gyroscopes o MEMS Pressure Sensors (Absolute Pressure Sensor, Vacuum Pressure Sensor, Sealed Pressure Sensor, Gauge Pressure Sensor and Differential Pressure Sensor) o MEMS Magnetic Field Sensors • Complementary Metal Oxide Semiconductor (CMOS) • Optical Sensing • Nanoelectromechanical Systems (NEMS) • Other Technologies By Industry Vertical, the Europe market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2032 included in each section. • Oil & Gas • Pharmaceuticals • Chemicals • Manufacturing • Automotive • Energy & Power • Mining • Other Industry Verticals Geographically, the following national/local markets are fully investigated: • Germany • UK • France • Spain • Italy • Netherlands • Rest of Europe (further segmented into Russia, Switzerland, Poland, Sweden, Belgium, Austria, Ireland, Norway, Denmark, and Finland) For each key country, detailed analysis and data for annual revenue ($ mn) are available for 2022-2032. The breakdown of national markets by Sensor Type, Technology and Industry Vertical over the forecast years are also included. The report also covers the current competitive scenario and the predicted trend; and profiles key vendors including market leaders and important emerging players. Selected Key Players: ABB Ltd. Amphenol Corporation Ams AG Bosch Sensortec GmbH Crocus Technology, Inc. Dwyer Instruments, Inc. Endress+Hauser Management AG Figaro Engineering Inc. Honeywell International Inc. Infineon Technologies AG Microchip Technology Inc. Nxp Semiconductors N.V. Omega Engineering Inc. Panasonic Corporation Renesas Electronics Corporation (Renesas) Rockwell Automation Inc. Sensirion AG Siemens AG STMicroelectronics NV TE Connectivity Ltd. Teledyne Technologies Inc. Texas Instruments Inc. (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.) ...

4/30/2023

North America industrial sensors market is projected to grow by 8.6% annually in the forecast period and reach $15,133.5 million by 2032, driven by the rising adoption of Industrial 4.0 and IIoT in manufacturing, a surging demand for smart sensor-enabled wearable devices, the increasing adoption of industrial robots, and growing automation in manufacturing and various other industries. Highlighted with 26 tables and 70 figures, this 141-page report “North America Industrial Sensors Market 2022-2032 by Sensor Type (Level, Pressure, Position, Gas, Image, Magnetic, Others), Category (Contact, Non-contact), Technology (MEMS, CMOS, Optical, NEMS), Industry Vertical (Oil & Gas, Pharmaceuticals, Chemicals, Manufacturing, Automotive, Others), and Country: Trend Forecast and Growth Opportunity” is based on a comprehensive research of the entire North America industrial sensors market and all its sub-segments through extensively detailed classifications. Profound analysis and assessment are generated from premium primary and secondary information sources with inputs derived from industry professionals across the value chain. The report is based on studies on 2020-2022 and provides forecast from 2023 till 2032 with 2022 as the base year. (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.) In-depth qualitative analyses include identification and investigation of the following aspects: • Market Structure • Growth Drivers • Restraints and Challenges • Emerging Product Trends & Market Opportunities • Porter’s Fiver Forces The trend and outlook of North America market is forecast in optimistic, balanced, and conservative view by taking into account of COVID-19 and Russia-Ukraine conflict. The balanced (most likely) projection is used to quantify North America industrial sensors market in every aspect of the classification from perspectives of Sensor Type, Category, Technology, Industry Vertical, and Country. Based on Sensor Type, the North America market is segmented into the following sub-markets with annual revenue ($ mn), average selling price (USD/unit), and volume (thousand units) for 2022-2032 included in each section. • Level Sensors • Pressure Sensors • Position Sensors • Gas Sensors • Image Sensor • Magnetic Sensor • Electromagnetic Sensor • Temperature Sensor • Flow Sensors • Force Sensors • Other Sensor Types Based on Category, the North America market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2032 included in each section. • Contact Sensors • Non-contact Sensors By Technology, the North America market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2032 included in each section. • Micro-Electro-Mechanical Systems (MEMS) o MEMS Gyroscopes o MEMS Pressure Sensors (Absolute Pressure Sensor, Vacuum Pressure Sensor, Sealed Pressure Sensor, Gauge Pressure Sensor and Differential Pressure Sensor) o MEMS Magnetic Field Sensors • Complementary Metal Oxide Semiconductor (CMOS) • Optical Sensing • Nanoelectromechanical Systems (NEMS) • Other Technologies By Industry Vertical, the North America market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2032 included in each section. • Oil & Gas • Pharmaceuticals • Chemicals • Manufacturing • Automotive • Energy & Power • Mining • Other Industry Verticals Geographically, the following national/local markets are fully investigated: • U.S. • Canada • Mexico For each key country, detailed analysis and data for annual revenue ($ mn) are available for 2022-2032. The breakdown of national markets by Sensor Type, Technology and Industry Vertical over the forecast years are also included. The report also covers the current competitive scenario and the predicted trend; and profiles key vendors including market leaders and important emerging players. Selected Key Players: ABB Ltd. Amphenol Corporation Ams AG Bosch Sensortec GmbH Crocus Technology, Inc. Dwyer Instruments, Inc. Endress+Hauser Management AG Figaro Engineering Inc. Honeywell International Inc. Infineon Technologies AG Microchip Technology Inc. Nxp Semiconductors N.V. Omega Engineering Inc. Panasonic Corporation Renesas Electronics Corporation (Renesas) Rockwell Automation Inc. Sensirion AG Siemens AG STMicroelectronics NV TE Connectivity Ltd. Teledyne Technologies Inc. Texas Instruments Inc. (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.) ...

4/30/2023

Global industrial sensors market will reach $54,673.1 million by 2032, growing by 9.5% annually over 2022-2032, driven by the rising adoption of Industrial 4.0 and IIoT in manufacturing, a surging demand for smart sensor-enabled wearable devices, the increasing adoption of industrial robots, and growing automation in manufacturing and various other industries. Highlighted with 86 tables and 108 figures, this 222-page report “Global Industrial Sensors Market 2022-2032 by Sensor Type (Level, Pressure, Position, Gas, Image, Magnetic, Others), Category (Contact, Non-contact), Technology (MEMS, CMOS, Optical, NEMS), Industry Vertical (Oil & Gas, Pharmaceuticals, Chemicals, Manufacturing, Automotive, Others), and Region: Trend Forecast and Growth Opportunity” is based on a comprehensive research of the entire global industrial sensors market and all its sub-segments through extensively detailed classifications. Profound analysis and assessment are generated from premium primary and secondary information sources with inputs derived from industry professionals across the value chain. The report is based on studies on 2020-2022 and provides forecast from 2023 till 2032 with 2022 as the base year. (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.) In-depth qualitative analyses include identification and investigation of the following aspects: • Market Structure • Growth Drivers • Restraints and Challenges • Emerging Product Trends & Market Opportunities • Porter’s Fiver Forces The trend and outlook of global market is forecast in optimistic, balanced, and conservative view by taking into account of COVID-19 and Russia-Ukraine conflict. The balanced (most likely) projection is used to quantify global industrial sensors market in every aspect of the classification from perspectives of Sensor Type, Category, Technology, Industry Vertical, and Region. Based on Sensor Type, the global market is segmented into the following sub-markets with annual revenue ($ mn), average selling price (USD/unit), and volume (thousand units) for 2022-2032 included in each section. • Level Sensors • Pressure Sensors • Position Sensors • Gas Sensors • Image Sensor • Magnetic Sensor • Electromagnetic Sensor • Temperature Sensor • Flow Sensors • Force Sensors • Other Sensor Types Based on Category, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2032 included in each section. • Contact Sensors • Non-contact Sensors By Technology, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2032 included in each section. • Micro-Electro-Mechanical Systems (MEMS) o MEMS Gyroscopes o MEMS Pressure Sensors (Absolute Pressure Sensor, Vacuum Pressure Sensor, Sealed Pressure Sensor, Gauge Pressure Sensor and Differential Pressure Sensor) o MEMS Magnetic Field Sensors • Complementary Metal Oxide Semiconductor (CMOS) • Optical Sensing • Nanoelectromechanical Systems (NEMS) • Other Technologies By Industry Vertical, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2032 included in each section. • Oil & Gas • Pharmaceuticals • Chemicals • Manufacturing • Automotive • Energy & Power • Mining • Other Industry Verticals Geographically, the following regions together with the listed national/local markets are fully investigated: • North America (U.S., Canada, and Mexico) • Europe (Germany, UK, France, Spain, Italy, Netherlands, Rest of Europe; Rest of Europe is further segmented into Russia, Switzerland, Poland, Sweden, Belgium, Austria, Ireland, Norway, Denmark, and Finland) • APAC (Japan, China, South Korea, Australia, India, and Rest of APAC; Rest of APAC is further segmented into Malaysia, Singapore, Indonesia, Thailand, New Zealand, Vietnam, Taiwan, and Philippines) • South America (Brazil, Chile, Argentina, Rest of South America) • MEA (UAE, Saudi Arabia, South Africa and Rest of MEA) For each aforementioned region and country, detailed analysis and data for annual revenue ($ mn) are available for 2022-2032. The breakdown of all regional markets by country and splitting of each national market by Sensor Type, Technology and Industry Vertical over the forecast years are also included. The report also covers the current competitive scenario and the predicted trend; and profiles key vendors including market leaders and important emerging players. Selected Key Players: ABB Ltd. Amphenol Corporation Ams AG Bosch Sensortec GmbH Crocus Technology, Inc. Dwyer Instruments, Inc. Endress+Hauser Management AG Figaro Engineering Inc. Honeywell International Inc. Infineon Technologies AG Microchip Technology Inc. Nxp Semiconductors N.V. Omega Engineering Inc. Panasonic Corporation Renesas Electronics Corporation (Renesas) Rockwell Automation Inc. Sensirion AG Siemens AG STMicroelectronics NV TE Connectivity Ltd. Teledyne Technologies Inc. Texas Instruments Inc. (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.) ...

2023-04-30

Asia Pacific advanced IC substrates market will grow by 7.6% annually with a total addressable market cap of $92,888.8 million over 2023-2031, driven by the rising adoption of advanced substrates in manufacturing of electronics, the increasing prevalence and functionality of consumer electronic products sch as smart devices and smart wearables, and the increasing penetration of advanced technologies such as 5G and IoT connected devices. Highlighted with 58 tables and 49 figures, this 131-page report “Asia Pacific Advanced IC Substrates Market 2022-2031 by Packaging Type (FC BGA, FC CSP, Others), Material Type (Rigid, Flex, Ceramic), Manufacturing Method (SP, AP, MSAP), Bonding Technology (Wire Bonding, FC Bonding, TAB), Application (Mobile and Consumer Electronics, Automotive and Transportation, IT and Telecom, Others), and Country: Trend Forecast and Growth Opportunity” is based on a comprehensive research of the entire Asia Pacific advanced IC substrates market and all its sub-segments through extensively detailed classifications. Profound analysis and assessment are generated from premium primary and secondary information sources with inputs derived from industry professionals across the value chain. The report is based on studies on 2021-2022 and provides forecast from 2023 till 2031 with 2022 as the base year. (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.) In-depth qualitative analyses include identification and investigation of the following aspects: • Market Structure • Growth Drivers • Restraints and Challenges • Emerging Product Trends & Market Opportunities • Porter’s Fiver Forces The trend and outlook of Asia Pacific market is forecast in optimistic, balanced, and conservative view by taking into account of COVID-19 and Russia-Ukraine conflict. The balanced (most likely) projection is used to quantify Asia Pacific advanced IC substrates market in every aspect of the classification from perspectives of Packaging Type, Material Type, Manufacturing Method, Bonding Technology, Application, and Country. Based on Packaging Type, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section. • FC BGA • FC CSP • Other Packaging Types Based on Material Type, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section. • Rigid Integrated Circuit Substrate • Flex Integrated Circuit Substrate • Ceramic Integrated Circuit Substrate By Manufacturing Method, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section. • Subtraction Process (SP) • Addition Process (AP) • Modified Semi-additive Process (MSAP) By Bonding Technology, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section. • Wire Bonding • FC Bonding • Tape Automated Bonding (TAB) By Application, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section. • Mobile and Consumer Electronics • Automotive and Transportation • IT and Telecom • Other Applications Geographically, the following national/local markets are fully investigated: • Japan • China • South Korea • Australia • Taiwan • Rest of APAC (further segmented into Malaysia, Singapore, Indonesia, Thailand, New Zealand, Vietnam, India, and Philippines) For each key country, detailed analysis and data for annual revenue ($ mn) are available for 2022-2031. The breakdown of national markets by Packaging Type, Material Type and Application over the forecast years is also included. The report also covers the current competitive scenario and the predicted trend; and profiles key vendors including market leaders and important emerging players. Selected Key Players: ASE Group AT&S Austria Technologie & Systemtechnik AG Fujitsu Ltd. IBIDEN Co., Ltd. Kinsus Interconnect Technology Corp. Korea Circuit Co., Ltd. KYOCERA Corporation LG Innotek Co., Ltd. Nan Ya PCB Co., Ltd. (Nan Ya Plastics Corporation) Shenzhen Fastprint Circuit Tech Shinko Electric Industries Co., Ltd. Siliconware Precision Industries Co., Ltd. STATS ChipPAC Pte. Ltd. (JCET GROUP CO. LTD) TTM Technologies Inc. Unimicron Corporation Zhen Ding Technology Holding Ltd. Zhuhai ACCESS Semiconductor (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.) ...

4/30/2023

Europe advanced IC substrates market was valued at $562.7 million in 2022 and will grow by 5.4% annually over 2022-2031, driven by the rising adoption of advanced substrates in manufacturing of electronics, the increasing prevalence and functionality of consumer electronic products sch as smart devices and smart wearables, and the increasing penetration of advanced technologies such as 5G and IoT connected devices. Highlighted with 61 tables and 50 figures, this 132-page report “Europe Advanced IC Substrates Market 2022-2031 by Packaging Type (FC BGA, FC CSP, Others), Material Type (Rigid, Flex, Ceramic), Manufacturing Method (SP, AP, MSAP), Bonding Technology (Wire Bonding, FC Bonding, TAB), Application (Mobile and Consumer Electronics, Automotive and Transportation, IT and Telecom, Others), and Country: Trend Forecast and Growth Opportunity” is based on a comprehensive research of the entire Europe advanced IC substrates market and all its sub-segments through extensively detailed classifications. Profound analysis and assessment are generated from premium primary and secondary information sources with inputs derived from industry professionals across the value chain. The report is based on studies on 2021-2022 and provides forecast from 2023 till 2031 with 2022 as the base year. (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.) In-depth qualitative analyses include identification and investigation of the following aspects: • Market Structure • Growth Drivers • Restraints and Challenges • Emerging Product Trends & Market Opportunities • Porter’s Fiver Forces The trend and outlook of Europe market is forecast in optimistic, balanced, and conservative view by taking into account of COVID-19 and Russia-Ukraine conflict. The balanced (most likely) projection is used to quantify Europe advanced IC substrates market in every aspect of the classification from perspectives of Packaging Type, Material Type, Manufacturing Method, Bonding Technology, Application, and Country. Based on Packaging Type, the Europe market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section. • FC BGA • FC CSP • Other Packaging Types Based on Material Type, the Europe market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section. • Rigid Integrated Circuit Substrate • Flex Integrated Circuit Substrate • Ceramic Integrated Circuit Substrate By Manufacturing Method, the Europe market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section. • Subtraction Process (SP) • Addition Process (AP) • Modified Semi-additive Process (MSAP) By Bonding Technology, the Europe market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section. • Wire Bonding • FC Bonding • Tape Automated Bonding (TAB) By Application, the Europe market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section. • Mobile and Consumer Electronics • Automotive and Transportation • IT and Telecom • Other Applications Geographically, the following national/local markets are fully investigated: • Germany • UK • France • Spain • Italy • Netherlands • Rest of Europe (further segmented into Russia, Switzerland, Poland, Sweden, Belgium, Austria, Ireland, Norway, Denmark, and Finland) For each key country, detailed analysis and data for annual revenue ($ mn) are available for 2022-2031. The breakdown of national markets by Packaging Type, Material Type and Application over the forecast years is also included. The report also covers the current competitive scenario and the predicted trend; and profiles key vendors including market leaders and important emerging players. Selected Key Players: ASE Group AT&S Austria Technologie & Systemtechnik AG Fujitsu Ltd. IBIDEN Co., Ltd. Kinsus Interconnect Technology Corp. Korea Circuit Co., Ltd. KYOCERA Corporation LG Innotek Co., Ltd. Nan Ya PCB Co., Ltd. (Nan Ya Plastics Corporation) Shenzhen Fastprint Circuit Tech Shinko Electric Industries Co., Ltd. Siliconware Precision Industries Co., Ltd. STATS ChipPAC Pte. Ltd. (JCET GROUP CO. LTD) TTM Technologies Inc. Unimicron Corporation Zhen Ding Technology Holding Ltd. Zhuhai ACCESS Semiconductor (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.) ...

4/30/2023

North America advanced IC substrates market is projected to grow by 6.8% annually in the forecast period and reach $1,919.2 million by 2031, driven by the rising adoption of advanced substrates in manufacturing of electronics, the increasing prevalence and functionality of consumer electronic products sch as smart devices and smart wearables, and the increasing penetration of advanced technologies such as 5G and IoT connected devices. Highlighted with 51 tables and 46 figures, this 125-page report “North America Advanced IC Substrates Market 2022-2031 by Packaging Type (FC BGA, FC CSP, Others), Material Type (Rigid, Flex, Ceramic), Manufacturing Method (SP, AP, MSAP), Bonding Technology (Wire Bonding, FC Bonding, TAB), Application (Mobile and Consumer Electronics, Automotive and Transportation, IT and Telecom, Others), and Country: Trend Forecast and Growth Opportunity” is based on a comprehensive research of the entire North America advanced IC substrates market and all its sub-segments through extensively detailed classifications. Profound analysis and assessment are generated from premium primary and secondary information sources with inputs derived from industry professionals across the value chain. The report is based on studies on 2021-2022 and provides forecast from 2023 till 2031 with 2022 as the base year. (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.) In-depth qualitative analyses include identification and investigation of the following aspects: • Market Structure • Growth Drivers • Restraints and Challenges • Emerging Product Trends & Market Opportunities • Porter’s Fiver Forces The trend and outlook of North America market is forecast in optimistic, balanced, and conservative view by taking into account of COVID-19 and Russia-Ukraine conflict. The balanced (most likely) projection is used to quantify North America advanced IC substrates market in every aspect of the classification from perspectives of Packaging Type, Material Type, Manufacturing Method, Bonding Technology, Application, and Country. Based on Packaging Type, the North America market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section. • FC BGA • FC CSP • Other Packaging Types Based on Material Type, the North America market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section. • Rigid Integrated Circuit Substrate • Flex Integrated Circuit Substrate • Ceramic Integrated Circuit Substrate By Manufacturing Method, the North America market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section. • Subtraction Process (SP) • Addition Process (AP) • Modified Semi-additive Process (MSAP) By Bonding Technology, the North America market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section. • Wire Bonding • FC Bonding • Tape Automated Bonding (TAB) By Application, the North America market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section. • Mobile and Consumer Electronics • Automotive and Transportation • IT and Telecom • Other Applications Geographically, the following national/local markets are fully investigated: • U.S. • Canada • Mexico For each key country, detailed analysis and data for annual revenue ($ mn) are available for 2022-2031. The breakdown of national markets by Packaging Type, Material Type and Application over the forecast years is also included. The report also covers the current competitive scenario and the predicted trend; and profiles key vendors including market leaders and important emerging players. Selected Key Players: ASE Group AT&S Austria Technologie & Systemtechnik AG Fujitsu Ltd. IBIDEN Co., Ltd. Kinsus Interconnect Technology Corp. Korea Circuit Co., Ltd. KYOCERA Corporation LG Innotek Co., Ltd. Nan Ya PCB Co., Ltd. (Nan Ya Plastics Corporation) Shenzhen Fastprint Circuit Tech Shinko Electric Industries Co., Ltd. Siliconware Precision Industries Co., Ltd. STATS ChipPAC Pte. Ltd. (JCET GROUP CO. LTD) TTM Technologies Inc. Unimicron Corporation Zhen Ding Technology Holding Ltd. Zhuhai ACCESS Semiconductor (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.) ...

4/30/2023

Global advanced IC substrates market will reach $16,953.8 million by 2031, growing by 7.3% annually over 2022-2031, driven by the rising adoption of advanced substrates in manufacturing of electronics, the increasing prevalence and functionality of consumer electronic products such as smart devices and smart wearables, and the increasing penetration of advanced technologies such as 5G and IoT connected devices. Highlighted with 110 tables and 82 figures, this 187-page report “Global Advanced IC Substrates Market 2022-2031 by Packaging Type (FC BGA, FC CSP, Others), Material Type (Rigid, Flex, Ceramic), Manufacturing Method (SP, AP, MSAP), Bonding Technology (Wire Bonding, FC Bonding, TAB), Application (Mobile and Consumer Electronics, Automotive and Transportation, IT and Telecom, Others), and Region: Trend Forecast and Growth Opportunity” is based on a comprehensive research of the entire global advanced IC substrates market and all its sub-segments through extensively detailed classifications. Profound analysis and assessment are generated from premium primary and secondary information sources with inputs derived from industry professionals across the value chain. The report is based on studies on 2021-2022 and provides forecast from 2023 till 2031 with 2022 as the base year. (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.) In-depth qualitative analyses include identification and investigation of the following aspects: • Market Structure • Growth Drivers • Restraints and Challenges • Emerging Product Trends & Market Opportunities • Porter’s Fiver Forces The trend and outlook of global market is forecast in optimistic, balanced, and conservative view by taking into account of COVID-19 and Russia-Ukraine conflict. The balanced (most likely) projection is used to quantify global advanced IC substrates market in every aspect of the classification from perspectives of Packaging Type, Material Type, Manufacturing Method, Bonding Technology, Application, and Region. Based on Packaging Type, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section. • FC BGA • FC CSP • Other Packaging Types Based on Material Type, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section. • Rigid Integrated Circuit Substrate • Flex Integrated Circuit Substrate • Ceramic Integrated Circuit Substrate By Manufacturing Method, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section. • Subtraction Process (SP) • Addition Process (AP) • Modified Semi-additive Process (MSAP) By Bonding Technology, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section. • Wire Bonding • FC Bonding • Tape Automated Bonding (TAB) By Application, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section. • Mobile and Consumer Electronics • Automotive and Transportation • IT and Telecom • Other Applications Geographically, the following regions together with the listed national/local markets are fully investigated: • North America (U.S., Canada, and Mexico) • Europe (Germany, UK, France, Spain, Italy, Netherlands, Rest of Europe; Rest of Europe is further segmented into Russia, Switzerland, Poland, Sweden, Belgium, Austria, Ireland, Norway, Denmark, and Finland) • APAC (Japan, China, South Korea, Australia, Taiwan, and Rest of APAC; Rest of APAC is further segmented into Malaysia, Singapore, Indonesia, Thailand, New Zealand, Vietnam, India, and Philippines) • South America (Brazil, Chile, Argentina, Rest of South America) • MEA (UAE, Saudi Arabia, South Africa and Rest of MEA) For each aforementioned region and country, detailed analysis and data for annual revenue ($ mn) are available for 2022-2031. The breakdown of all regional markets by country and split of each national market by Packaging Type, Material Type and Application over the forecast years are also included. The report also covers the current competitive scenario and the predicted trend; and profiles key vendors including market leaders and important emerging players. Selected Key Players: ASE Group AT&S Austria Technologie & Systemtechnik AG Fujitsu Ltd. IBIDEN Co., Ltd. Kinsus Interconnect Technology Corp. Korea Circuit Co., Ltd. KYOCERA Corporation LG Innotek Co., Ltd. Nan Ya PCB Co., Ltd. (Nan Ya Plastics Corporation) Shenzhen Fastprint Circuit Tech Shinko Electric Industries Co., Ltd. Siliconware Precision Industries Co., Ltd. STATS ChipPAC Pte. Ltd. (JCET GROUP CO. LTD) TTM Technologies Inc. Unimicron Corporation Zhen Ding Technology Holding Ltd. Zhuhai ACCESS Semiconductor (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.) ...

2023-04-30

Asia Pacific smart card market will grow by 7.8% annually with a total addressable market cap of $85,100.6 million over 2023-2032, driven by the rising popularity and adoption of these smart cards in various sectors, the high penetration of smart cards in access control and personal identification applications, expansion in the Asia Pacific mobile network and enhancements in its infrastructure, and the surging demand for contactless payments amid COVID-19 pandemic. Highlighted with 83 tables and 58 figures, this 162-page report “Asia Pacific Smart Card Market 2022-2032 by Component (Hardware, Software, Services), Interface (Contact-based, Contactless, Dual, Hybrid), Card Type (Memory-based, MPU Microprocessor), Function (Transaction, Communication, Security & Access Control, Others), Industry Vertical, and Country: Trend Forecast and Growth Opportunity” is based on a comprehensive research of the entire Asia Pacific smart card market and all its sub-segments through extensively detailed classifications. Profound analysis and assessment are generated from premium primary and secondary information sources with inputs derived from industry professionals across the value chain. The report is based on studies on 2020-2022 and provides forecast from 2023 till 2032 with 2022 as the base year. (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.) In-depth qualitative analyses include identification and investigation of the following aspects: • Market Structure • Growth Drivers • Restraints and Challenges • Emerging Product Trends & Market Opportunities • Porter’s Fiver Forces The trend and outlook of Asia Pacific market is forecast in optimistic, balanced, and conservative view by taking into account of COVID-19 and Russia-Ukraine conflict. The balanced (most likely) projection is used to quantify Asia Pacific smart card market in every aspect of the classification from perspectives of Component, Interface, Card Type, Function, Industry Vertical, and Country. Based on Component, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2032 included in each section. • Hardware o Smart Cards o Smart Card Readers • Software • Services Based on Interface, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2032 included in each section. • Contact-based Smart Cards • Contactless Smart Cards • Dual-interface Smart Cards • Hybrid Smart Cards By Card Type, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2032 included in each section. • Memory-based Smart Cards • MPU Microprocessor-based Smart Cards By Function, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2032 included in each section. • Transaction • Communication • Security & Access Control • Other Functions By Industry Vertical, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2032 included in each section. • BFSI • IT and Telecom • Government • Transportation • Healthcare • Retail Industry • Education • Other Industry Verticals Geographically, the following national/local markets are fully investigated: • Japan • China • South Korea • Australia • India • Rest of APAC (further segmented into Malaysia, Singapore, Indonesia, Thailand, New Zealand, Vietnam, Taiwan, and Philippines) For each key country, detailed analysis and data for annual revenue ($ mn) are available for 2022-2032. The breakdown of national markets by Interface, Function, and Industry Vertical over the forecast years are also included. The report also covers the current competitive scenario and the predicted trend; and profiles key vendors including market leaders and important emerging players. Selected Key Players: ABCorp (American Banknote Corporation) Alioth LLC Bundesdruckerei GmbH CardLogix Corporation CPI Card Group Inc. Eastcompeace Technology Co., Ltd. (Potevio Group) Fingerprint Cards AB Gemalto NV (Thales Group) Giesecke & Devrient GmbH (MC Familiengesellschaft mbH) HID Asia Pacific Corporation (Assa Abloy AB) IDEMIA France SAS Identiv, Inc. Infineon Technologies AG IntelCav Inteligensa SA de CV KONA I Co., Ltd. NXP Semiconductors NV Samsung Electronics Co., Ltd. Secura Key VISA Inc. Watchdata Technologies (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.) ...

4/30/2023

Europe smart card market was valued at $3,724.5 million in 2022 and will grow by 6.0% annually over 2022-2032, driven by the rising popularity and adoption of these smart cards in various sectors, the high penetration of smart cards in access control and personal identification applications, expansion in the Europe mobile network and enhancements in its infrastructure, and the surging demand for contactless payments amid COVID-19 pandemic. Highlighted with 86 tables and 59 figures, this 162-page report “Europe Smart Card Market 2022-2032 by Component (Hardware, Software, Services), Interface (Contact-based, Contactless, Dual, Hybrid), Card Type (Memory-based, MPU Microprocessor), Function (Transaction, Communication, Security & Access Control, Others), Industry Vertical, and Country: Trend Forecast and Growth Opportunity” is based on a comprehensive research of the entire Europe smart card market and all its sub-segments through extensively detailed classifications. Profound analysis and assessment are generated from premium primary and secondary information sources with inputs derived from industry professionals across the value chain. The report is based on studies on 2020-2022 and provides forecast from 2023 till 2032 with 2022 as the base year. (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.) In-depth qualitative analyses include identification and investigation of the following aspects: • Market Structure • Growth Drivers • Restraints and Challenges • Emerging Product Trends & Market Opportunities • Porter’s Fiver Forces The trend and outlook of Europe market is forecast in optimistic, balanced, and conservative view by taking into account of COVID-19 and Russia-Ukraine conflict. The balanced (most likely) projection is used to quantify Europe smart card market in every aspect of the classification from perspectives of Component, Interface, Card Type, Function, Industry Vertical, and Country. Based on Component, the Europe market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2032 included in each section. • Hardware o Smart Cards o Smart Card Readers • Software • Services Based on Interface, the Europe market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2032 included in each section. • Contact-based Smart Cards • Contactless Smart Cards • Dual-interface Smart Cards • Hybrid Smart Cards By Card Type, the Europe market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2032 included in each section. • Memory-based Smart Cards • MPU Microprocessor-based Smart Cards By Function, the Europe market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2032 included in each section. • Transaction • Communication • Security & Access Control • Other Functions By Industry Vertical, the Europe market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2032 included in each section. • BFSI • IT and Telecom • Government • Transportation • Healthcare • Retail Industry • Education • Other Industry Verticals Geographically, the following national/local markets are fully investigated: • Germany • UK • France • Spain • Italy • Russia • Rest of Europe (further segmented into Netherlands, Switzerland, Poland, Sweden, Belgium, Austria, Ireland, Norway, Denmark, and Finland) For each key country, detailed analysis and data for annual revenue ($ mn) are available for 2022-2032. The breakdown of national markets by Interface, Function, and Industry Vertical over the forecast years are also included. The report also covers the current competitive scenario and the predicted trend; and profiles key vendors including market leaders and important emerging players. Selected Key Players: ABCorp (American Banknote Corporation) Alioth LLC Bundesdruckerei GmbH CardLogix Corporation CPI Card Group Inc. Eastcompeace Technology Co., Ltd. (Potevio Group) Fingerprint Cards AB Gemalto NV (Thales Group) Giesecke & Devrient GmbH (MC Familiengesellschaft mbH) HID Europe Corporation (Assa Abloy AB) IDEMIA France SAS Identiv, Inc. Infineon Technologies AG IntelCav Inteligensa SA de CV KONA I Co., Ltd. NXP Semiconductors NV Samsung Electronics Co., Ltd. Secura Key VISA Inc. Watchdata Technologies (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.) ...

4/30/2023

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